Karl Suss RC-8
CAC Name: RC-8
SussTec GYRSET wafer spin tool
Manager: Edward CamachoBackup: Garry Bordonaro
The GYRSET System comprises a bell-shaped cover placed over the chuck and the substrate. During a spin cycle, the cover closes, creating a solvent-saturated atmosphere. All the parts involved in the GYRSET System rotate synchronously as does the confined air inside the cover. Turbulence, which can cause excessive thickness in the corners of the substrate, is thus eliminated. The photoresist coating is spread evenly over the entire surface.
Materials Allowed in this Spinner
Uniform coatings can be spun on any shape substrate as well as over difficult topology.
Additional Resources:Equipment Information Sheet: Karl Suss Gyrset RC-8a
Equipment Information Sheet: Karl Suss Gyrset RC-8b
User Instruction Manual Rev. 2 2007
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Photolithography Training Sessions for the Week of September 18th
Sep 18, 2017
General Photolithography training will be offered Tuesday at 1:30PM. We will meet in the Spinner room.
Heidelberg DWL2000 Mask Writer Training will be offered Wednesday at 3:30PM. Meet at the tool.
AB-M contact aligner, Schott IR inspection tool, MA6 contact aligner, and Wafer Bonder training can be scheduled with Edward Camacho.
For any other training sessions, this week contact the tool owner for scheduling. Please review the materials available at each of the web page ...more
ASML DUV Stepper *UNAVAILABLE* Thursday September 21st 9:00 am - Noon
Sep 14, 2017
The ASML DUV Stepper will be UNAVAILABLE Thursday, September 21st, as ASML will be performing diagnostics on the tool.
ABM Contact Aligner
ASML 300C DUV Stepper
Autostep i-line Stepper
Edge Bead Removal System
Gamma Automatic Coat-Develop Tool
GCA 5x Stepper
Hamatech-Steag Mask Processors
Hamatech-Steag Wafer Processors
Heidelberg Mask Writer DWL2000
Heidelberg Mask Writer DWL66FS
JBA 1000 Photoresist UV Cure
Karl Suss RC-8
Manual Resist Spinners
Photolithography Hot Plates
Resist Hot Strip Bath
Suss MA6-BA6 Contact Aligner
Suss MJB4 Contact Aligner
Suss SCIL Imprint
YES Image Reversal Oven
YES Polyimide Bake Oven
YES Vapor Prime Oven
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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: email@example.com
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