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PHOTOLITHOGRAPHY
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Karl Suss RC-8

CAC Name: RC-8

SussTec GYRSET wafer spin tool

Backup: Garry Bordonaro
Equipment Training
Training is scheduled on an as-needed need basis. The training does not take too much time, and most of it is focused on how to write and edit recipes. If you need training, please send Edward an email to schedule it.

Description:

The GYRSET System comprises a bell-shaped cover placed over the chuck and the substrate. During a spin cycle, the cover closes, creating a solvent-saturated atmosphere. All the parts involved in the GYRSET System rotate synchronously as does the confined air inside the cover. Turbulence, which can cause excessive thickness in the corners of the substrate, is thus eliminated. The photoresist coating is spread evenly over the entire surface.
Because of the solvent saturated atmosphere, all the usual spinning defects (rebounding, splashback, comet and striation) are eliminated. Any substrate shapes and thicknesses can be processed with our GYRSET System with the guarantee of unrivalled coating performance. The GYRSET System uses up to 4 times less resist than the best classical spinner. Photoresist recycling could then be possible due to a very low risk of contamination in the atmosphere.
With the GYRSET System, lower speed and acceleration are used during the spin cycle which means less vibration and so less stress on your substrate. This also saves on wear on the spin motor and the mechanics, increasing the lifetime of your spin coater.

Capabilities:

  • GYRSET spin technology for uniform coating
  • Maximum substrate size is supported by the tool is 100mm
  • Maximum substrate thickness is 4mm
  • Maximum spin speed is 5000 RPM
  • Maximum acceleration is 1000 RPM/sec
  • Pieces can be spun with a gasket
  • 8 programs are available

Processes Available:

Materials Allowed in this Spinner

P-20
KMPR
SU-8 2000
SU-8 3000
Cyclopentanone
Cyclotene
AP 3000

*** NO ACETONE ***
*** NO IPA ***
*** NO METHANOL ***

Applications:

Uniform coatings can be spun on any shape substrate as well as over difficult topology.


Additional Resources:

Equipment Information Sheet: Karl Suss Gyrset RC-8a
Equipment Information Sheet: Karl Suss Gyrset RC-8b
User Instruction Manual Rev. 2 2007


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Photolithography Training Sessions for the Week of September 18th
Sep 18, 2017
General Photolithography training will be offered Tuesday at 1:30PM. We will meet in the Spinner room.

Heidelberg DWL2000 Mask Writer Training will be offered Wednesday at 3:30PM. Meet at the tool.

AB-M contact aligner, Schott IR inspection tool, MA6 contact aligner, and Wafer Bonder training can be scheduled with Edward Camacho.

________


For any other training sessions, this week contact the tool owner for scheduling. Please review the materials available at each of the web page ...more
ASML DUV Stepper *UNAVAILABLE* Thursday September 21st 9:00 am - Noon
Sep 14, 2017
The ASML DUV Stepper will be UNAVAILABLE Thursday, September 21st, as ASML will be performing diagnostics on the tool.

Garry

EQUIPMENT LIST


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