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K&S Gold Ball Bonder
Ball, Wedge type Thermosonic wire Bonder
Equipment Training
Training takes about 2 - 4 hours, and is done as needed. Please contact the tool manager to schedule training.

Description:

This is a Wire bonding system used to make electrical connections between the bonding pads on chips, and the gold bonding pads on a chip carrier, or package. It uses .001 inch Gold wire with a combination of ultrasonics at the bonding tip, and heat on the device to make these connections. An electronic flame-0ff is used to melt a ball on the end of the wire which makes the first bond. The second bond can be made in any direction from the first bond.. The device to be bonded must be thermally coupled to the stage, and heated to about 170 degrees C.

Capabilities:

Two different modes of operation are always available.. A manual Z mode allows the operator to control the bonding head vertical motion, and a Chessman mode using preset search heights can also be used.


Additional Resources:

Equipment Information Sheet


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