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PHOTOLITHOGRAPHY
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ABM Contact Aligner

CAC Name: ABM

Flexible 200mm Mask Aligner with DUV light source

ABM Contact Aligner Backup: Garry Bordonaro
Equipment Training
Training is offered weekly on a per need basis specially when there are new users. Please check the Training Schedule or contact the tool manager. Make sure before you request contact aligner training you have completed “General Lithography Training”, since it is a prerequisite.

Description:

ABM's High Resolution Mask Aligner is a very versatile instrument with interchangeable light sources which allow Near-UV (405-365 nm) as well as Mid- and Deep-UV (254 nm, 220 nm) exposures in proximity (non-contact) or contact (soft & hard) modes. The exposure can cover an area 200 mm in diameter. The bottom-mount mask system accommodates masks up to 9 inches square and substrates from small chips to wafers up to 200 mm. The alignment tooling system also features an air-bearing substrate-to-mask planarization system for wedge-error compensation. The printing resolution is 0.8 µm for Near-UV and 0.4 µm for Mid-UV and Deep-UV in vacuum contact mode. Exposures in Mid- and Deep-UV require quartz masks.

Capabilities:

  • Hard or Soft Contact Modes
  • Any size or shape sample up to 200mm and 0.250in.
  • UV, Mid-UV, and DUV Exposure Modes
  • Split-field CCD Zoom Microscope Alignment System
  • Bottom-mounting Mask Holders


Additional Resources:

Equipment Information Sheet

Results:


Near-UV Vacuum Contact, Rohm and Haas S1805 550nm, PAB 115C 45 sec., ABM 1.1 sec., PEB 115C 30 sec., Dev. 300MIF 45 sec.


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DWL2000 *DOWN*
Dec 12, 2017
The DWL2000 is DOWN again due to focus system issues. HIMT is working on the problem. This notice will be updated as more info is available.

Garry
UPDATED - ASML DUV Stepper *UNAVAILABLE* January 9th - 12th
Dec 01, 2017
The ASML DUV stepper will be unavailable due to a maintenance visit beginning January 9th. Please plan accordingly.

Garry

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