ABM Contact Aligner
CAC Name: ABM
Flexible 200mm Mask Aligner with DUV light source
Manager: Edward CamachoBackup: Garry Bordonaro
ABM's High Resolution Mask Aligner is a very versatile instrument with interchangeable light sources which allow Near-UV (405-365 nm) as well as Mid- and Deep-UV (254 nm, 220 nm) exposures in proximity (non-contact) or contact (soft & hard) modes. The exposure can cover an area 200 mm in diameter. The bottom-mount mask system accommodates masks up to 9 inches square and substrates from small chips to wafers up to 200 mm. The alignment tooling system also features an air-bearing substrate-to-mask planarization system for wedge-error compensation. The printing resolution is 0.8 µm for Near-UV and 0.4 µm for Mid-UV and Deep-UV in vacuum contact mode. Exposures in Mid- and Deep-UV require quartz masks.
Additional Resources:Equipment Information Sheet
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Photolithography Training Sessions for the Week of September 18th
Sep 18, 2017
General Photolithography training will be offered Tuesday at 1:30PM. We will meet in the Spinner room.
Heidelberg DWL2000 Mask Writer Training will be offered Wednesday at 3:30PM. Meet at the tool.
AB-M contact aligner, Schott IR inspection tool, MA6 contact aligner, and Wafer Bonder training can be scheduled with Edward Camacho.
For any other training sessions, this week contact the tool owner for scheduling. Please review the materials available at each of the web page ...more
ASML DUV Stepper *UNAVAILABLE* Thursday September 21st 9:00 am - Noon
Sep 14, 2017
The ASML DUV Stepper will be UNAVAILABLE Thursday, September 21st, as ASML will be performing diagnostics on the tool.
ABM Contact Aligner
ASML 300C DUV Stepper
Autostep i-line Stepper
Edge Bead Removal System
Gamma Automatic Coat-Develop Tool
GCA 5x Stepper
Hamatech-Steag Mask Processors
Hamatech-Steag Wafer Processors
Heidelberg Mask Writer DWL2000
Heidelberg Mask Writer DWL66FS
JBA 1000 Photoresist UV Cure
Karl Suss RC-8
Manual Resist Spinners
Photolithography Hot Plates
Resist Hot Strip Bath
Suss MA6-BA6 Contact Aligner
Suss MJB4 Contact Aligner
Suss SCIL Imprint
YES Image Reversal Oven
YES Polyimide Bake Oven
YES Vapor Prime Oven
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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: firstname.lastname@example.org
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