ComputingCleanroom and Equipment StatusCoral - XReporter
Button: Equipment ListButton: MSDS DatabaseButton: Policies & FormsButton: Education & TrainingButton: StaffButton: Events & Seminars Button: Publication Button: About CNF Button: Lab Manual

ETCHING
     Schedule Training   ¦



YES Asher

CAC Name: yesasher

YES CV200RFS Oxygen Plasma Asher

YES CV200RFS Oxygen Plasma Asher Backup: Michael Skvarla
Equipment Training
Training takes about a half hour and is set up as needed through e-mail. Please contact Jerry Drumheller (drumheller@cnf.cornell.edu) to set up a mutually convenient time.

Description:

Vacuum system with Oxygen Plasma, designed for Resist Stripping and Descum. It uses a 9" diameter Hot Plate stage to control wafer temperature. The system is used to strip resist off single wafers, up to 8" diameter. The 40 KHz plasma is isolated from the wafer by a grounded, perforated metal plate.

Capabilities:

  • Wafer is temperature controlled from 30 - 250°C.
  • 40 KHz power is variable, up to 1250 Watts
  • Strip rates greater than 1 micron per minute for soft baked resist
  • Typical process times are 30 sec. to 5 min..
  • Process times greater than an hour can be done.

Processes Available:

Oxygen is used for removing organics. Nitrogen and Argon are also available for gentle cleaning and oxide removal. Typical operating pressure is 300-350 mTorr.
Low power and low temperature give good versatility for descum processes.

Applications:

Resist Stripping, Patterned Resist Descum, Wafer Cleaning.


Additional Resources:

Equipment Information Sheet


Back to Top


EQUIPMENT LIST


Button: Search Button: Search Keywords
Cornell University
NYSTARNNCINSF