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FURNACE PROCESSING
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TFT Wet/Dry Oxide - A2

CAC Name: TFT Oxide

MRL Industries Furnace for thermal oxidation of TFT compatible substrates

Manager: Phil Infante
Backup: Aaron Windsor , Daniel McCollister
Equipment Training
Training for the furnace area covers the pre-furnace MOS clean, atmospheric and LPCVD processes. It is scheduled on a need basis, please email the tool manager for training requests. Include MOS area training in the subject header. You will be notified when the next scheduled training will be by email.

Description:

The TFT Oxide Furnace is an atmospheric furnace with a 42” flat zone capable of processing up to 6” diameter wafers. The furnace tube is equipped with an external torch for pyrogenic wet oxidation,O2 for dry oxidation and O2/inert mixtures, as well as an N2 anneal ambient. Samples are restricted to silicon or TFT based materials only.

Capabilities:

  • Wet and dry oxidation
  • HCL during oxidation up to a 4% level
  • Anneals in N2 ambient
  • Pieces to 6” diameter wafers can be processed
  • Maximum temperature of 1100°C


Additional Resources:

Equipment Information Sheet
Location of tool in cleanroom (jpg)


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