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FURNACE PROCESSING
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LPCVD LTO - B3

CAC Name: LTO

MRL Industries Furnace for low temperature oxide deposition on silicon based substrates

MRL Furnace
Manager: Phil Infante
Backup: Aaron Windsor , Daniel McCollister
Equipment Training
Training for the furnace area covers the pre-furnace MOS clean, atmospheric and LPCVD processes. It is scheduled on a need basis, please email the tool manager for training requests. Include MOS area training in the subject header. You will be notified when the next scheduled training will be by email.

Description:

The LPCVD Low Temperature Oxide furnace is a low pressure CVD furnace with a 40” flat zone capable of processing up to 6” diameter wafers. Process gases used are SiH4 and O2. Samples are restricted to silicon based materials only.

Capabilities:

  • Low Temperature deposited Oxide
  • 20 nm/min dep rate at 425°C


Additional Resources:

Equipment Information Sheet
Location of tool in cleanroom (jpg)


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