ComputingCleanroom and Equipment StatusCoral - XReporter
Button: Equipment ListButton: MSDS DatabaseButton: Policies & FormsButton: Education & TrainingButton: StaffButton: Events & Seminars Button: Publication Button: About CNF Button: Lab Manual

FURNACE PROCESSING
Report Trouble   ¦    View Open Trouble   ¦    Schedule Training   ¦



N+/P+ Polysilicon - C4

CAC Name: N+/P+ Poly

MRL Industries Furnace for deposition of polysilicon on silicon substrates

MRL Furnace
Manager: Phil Infante
Backup: Aaron Windsor , Daniel McCollister
Equipment Training
Training for the furnace area covers the pre-furnace MOS clean, atmospheric and LPCVD processes. It is scheduled on a need basis, please email the tool manager for training requests. Include MOS area training in the subject header. You will be notified when the next scheduled training will be by email.

Description:

The LPCVD Polysilicon Furnace is a low pressure CVD furnace with a 40” flat zone capable of processing up to 6” diameter wafers. Process gases available are SiH4, N2/PH3 and N2/B2H6 mixes for insitu doping, HCL for cleaning. Samples are restricted to silicon based materials only.

Capabilities:

  • Doped and undoped silicon films ranging from amorphous to poly
  • As-deposited doped film resistivities of 3-25 mohm-cm
  • Deposition temperatures from 450 to 670°C


Additional Resources:

Equipment Information Sheet
C4 N+_P+ Poly Furn Instructions
Location of tool in cleanroom (jpg)


Back to Top


EQUIPMENT LIST


Button: Search Button: Search Keywords
Cornell University
NYSTARNNCINSF