Autostep i-line Stepper
CAC Name: Autostep
GCA Autostep 200 DSW i-line Wafer Stepper
Manager: Garry BordonaroBackup: Michael Skvarla
The Autostep 200 is a production-level 5X reduction wafer exposure tool designed for up to 200mm wafers. All operations are automated, including wafer loading (100mm wafers) and aligning, and reticle loading and aligning (5"). Wafer leveling is used to provide optimum focus range. The focus system uses broadband light and is repeatable to <0.2µm. Overlay is specified as <0.125µm using local alignment; we have seen well below that. All tool calibrations are performed automatically, and the focus system uses elaborate compensation for lens heating and barometric shifts. With N.A. of 0.45 and Sigma of 0.5, the tool is specified for 0.65µm features; we have printed <0.5µm.
Additional Resources:Equipment Information Sheet
Alignment Mark GDS Files
Autostep Operation Manual
AS200 Resist Matrix
Autostep manuals and training notes
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Photolithography Training Sessions for the Week of September 18th
Sep 18, 2017
General Photolithography training will be offered Tuesday at 1:30PM. We will meet in the Spinner room.
Heidelberg DWL2000 Mask Writer Training will be offered Wednesday at 3:30PM. Meet at the tool.
AB-M contact aligner, Schott IR inspection tool, MA6 contact aligner, and Wafer Bonder training can be scheduled with Edward Camacho.
For any other training sessions, this week contact the tool owner for scheduling. Please review the materials available at each of the web page ...more
ASML DUV Stepper *UNAVAILABLE* Thursday September 21st 9:00 am - Noon
Sep 14, 2017
The ASML DUV Stepper will be UNAVAILABLE Thursday, September 21st, as ASML will be performing diagnostics on the tool.
ABM Contact Aligner
ASML 300C DUV Stepper
Autostep i-line Stepper
Edge Bead Removal System
Gamma Automatic Coat-Develop Tool
GCA 5x Stepper
Hamatech-Steag Mask Processors
Hamatech-Steag Wafer Processors
Heidelberg Mask Writer DWL2000
Heidelberg Mask Writer DWL66FS
JBA 1000 Photoresist UV Cure
Karl Suss RC-8
Manual Resist Spinners
Photolithography Hot Plates
Resist Hot Strip Bath
Suss MA6-BA6 Contact Aligner
Suss MJB4 Contact Aligner
Suss SCIL Imprint
YES Image Reversal Oven
YES Polyimide Bake Oven
YES Vapor Prime Oven
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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: firstname.lastname@example.org
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