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PHOTOLITHOGRAPHY
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Autostep i-line Stepper

CAC Name: Autostep

GCA Autostep 200 DSW i-line Wafer Stepper

GCA AS200 Wafer Stepper Backup: Michael Skvarla
Equipment Training
Autostep training is done as an addition to standard stepper training. Users should first have some experience with the other steppers before using the Autostep 200 if possible. Training for the AS200 is usually given one-on-one in the form of assisting with job setup and execution during the first use of the tool. Group sessions can be arranged if required.
There are no training sessions currently scheduled.

Description:

The Autostep 200 is a production-level 5X reduction wafer exposure tool designed for up to 200mm wafers. All operations are automated, including wafer loading (100mm wafers) and aligning, and reticle loading and aligning (5"). Wafer leveling is used to provide optimum focus range. The focus system uses broadband light and is repeatable to <0.2µm. Overlay is specified as <0.125µm using local alignment; we have seen well below that. All tool calibrations are performed automatically, and the focus system uses elaborate compensation for lens heating and barometric shifts. With N.A. of 0.45 and Sigma of 0.5, the tool is specified for 0.65µm features; we have printed <0.5µm.


Service schedule for the GCA tools is posted at: http://www.cnf.cornell.edu/cnf_maintenancecalendar.html

Capabilities:

  • Automatic Wafer Handler (set for 100mm wafers)
  • 200mm Wafer Stage
  • 0.45 N.A. 5X Reduction Tropel Lens
  • 15mm2 Exposure Field
  • Wafer Leveling (including 2
  • Reticle Management System (up to 10 reticles)
  • INSITU Tool Setup
  • Smart Set Metrology Software
  • Interchangable Hand-held Wafer Chucks
  • uDFAS Die-by-Die Alignment


Additional Resources:

Equipment Information Sheet
Alignment Mark GDS Files
Autostep Operation Manual
AS200 Resist Matrix
Autostep manuals and training notes


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Photolithography Training Sessions for the Week of September 18th
Sep 18, 2017
General Photolithography training will be offered Tuesday at 1:30PM. We will meet in the Spinner room.

Heidelberg DWL2000 Mask Writer Training will be offered Wednesday at 3:30PM. Meet at the tool.

AB-M contact aligner, Schott IR inspection tool, MA6 contact aligner, and Wafer Bonder training can be scheduled with Edward Camacho.

________


For any other training sessions, this week contact the tool owner for scheduling. Please review the materials available at each of the web page ...more
ASML DUV Stepper *UNAVAILABLE* Thursday September 21st 9:00 am - Noon
Sep 14, 2017
The ASML DUV Stepper will be UNAVAILABLE Thursday, September 21st, as ASML will be performing diagnostics on the tool.

Garry

EQUIPMENT LIST


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