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ETCHING
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Oxford 100 Etcher

CAC Name: Oxford 100

Oxford PlasmaLab 100 RIE System for fluorine based ICP deep SiO2/glass etching

Oxford 100
Manager: Vince Genova
Backup: Tom Pennell , Jeremy Clark
Equipment Training
Training is scheduled on an as needed basis. Please contact Vince Genova via email to schedule a session.

Description:

The Oxford Plasmalab100 is an inductively coupled plasma based system that is configured for silicon based dielectric etching. The system consists of one ICP process module connected to a single automated wafer transfer load lock. It is equipped with He backside cooling and has a temperature controlled electrode.

Capabilities:

  • Fluroinated gases: CHF3, CF4, CH2F2, C4F6,C4F8
  • Other gases: CO2, Ar, O2, N2, He
  • Materials: thermal, PECVD and LPCVD oxides
  • Glasses: Quartz, Fused silica only, no pyrex or borofloat


Additional Resources:

Equipment Information Sheet
Etch Baseline Data


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Oxford 100 DOWN for annual PM
Sep 18, 2017
The annual PM for the Oxford 100 will occur this week, starting on 9/18. Beyond the standard work, this time will be used to sort out handling issues. Check the notice board and CORAL for status updates.

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