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ETCHING
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PT770 Etcher

CAC Name: PT 770

PlasmaTherm 770 two chamber inductively coupled plasma etching system for plasma etching using Chlorine or Fluorine

Plasmatherm 770
Manager: Tom Pennell
Backup: Vince Genova , Jerry Drumheller
Equipment Training
Training is conducted on an as needed basis. Please contact tool manager via email to schedule a session.

Description:

The PT770 is a dual chamber ICP system. The left chamber is dedicated to shallow(<10u) silicon etching (both polycrystalline and single crystal)in chlorine chemistry. Only oxide masking is allowed in this chamber and etch rates up to 0.5u/min are possible. The right chamber is dedicated to III-V materials only (no bulk silicon). It is equipped with both chlorine and methane based chemistry. Materials such as GaAs, InP, GaN and associated tertiaries and quarternaries can be etched successfully.

Capabilities:

  • Load Locked sample introduction
  • 3
  • Turbomolecular pumping
  • Microprocessor etch recipe control
  • Shallow silicon etching with oxide masks-left chamber
  • III-V based materials etching in the right chamber


Additional Resources:

Equipment Information Sheet
Etch Baseline Data
Location of tool in cleanroom (jpg)


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