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METROLOGY
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FleXus Film Stress Measurement

CAC Name: FleXus Film Stress Measurement

Noncontact tool for measuring film stress.

FleXus, Film Stress Measurement Backup: Phil Infante
Equipment Training
Training is a combination of machine demonstration, and hands on use, which takes about one hour. For training email Jerry Drumheller, drumheller@cnf.cornell.edu

Description:

A laser scan technique is used to measure wafer surface curvature before, and after wafer processing. Two wavelengths (670 nm and 780 nm) are available to ensure adequate reflected signal from the wafer. The calculated change in curvature is then used to calculate the stress in the film. The wafer is scanned on a hot plate which can be programed for stress vs. temperature measurements.


Additional Resources:

Equipment Information Sheet


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