Vince Genova
Title
Research Staff-Etch/ALD
Email - Directory
genova@cnf.cornell.edu
Office Phone
Bio

Vincent J. Genova completed his undergraduate work in physics at the State University of New York at Binghamton and his graduate studies in applied physics at Cornell University. He began his professional career with the IBM Corporation, spanning over a decade, as a staff engineer/scientist at the East Fishkill Development Laboratory, where he was a member of the Yorktown/E. Fishkill Gallium Arsenide MESFET team. There his emphasis was on advanced III-V microelectronic device development and process integration. He was later responsible for the technical management and direction of the GaAs Engineering Development Lab at the IBM Federal Systems Division. There he developed Monolithic Microwave Integrated Circuits based on advanced transistor structures including MODFETs, p-HEMTs, and HBTs. While at IBM, he was the principal investigator of a joint IBM/Cornell Nanofabrication Facility project using electron beam lithography for high performance MMICs. He also served as an IBM Interdivisional Technical Liaison for Thin Films and was involved in Flat Panel Display (AMLCD-TFT) process development with the IBM Yorktown TFT team. He later joined the Eastman Kodak Research Labs in Rochester, NY as a senior member of the technical staff. There he worked on process integration for MEMS based microfluidic devices. He was given the opportunity to return to his alma mater and joined the Cornell Nanofabrication Facility as a research staff member in 1999, where he was responsible for the MEMS Exchange program at CNF until 2005. Currently at CNF, he is active in process development and technical direction for the reactive ion etching and atomic layer deposition areas, and assists the facility with projects involving MEMS, Si-CMOS, and advanced III-V based device processing. He serves as the National Nanotechnology Coordinated Infrastructure (NNCI) Etch Working Group leader and has conducted numerous workshops in plasma etching and atomic layer deposition. He has authored many articles and patent disclosures and is an active member of the American Vacuum Society’s (AVS) thin film, electronic materials, and surface science divisions where he serves as a reviewer for JVST-A.

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