Packaging & Misc Processing

General use hot plate for large substrates.

General use manual spinner for large substrates.

This fluidic probe station makes quick, non-permanent, compression connections to microfluidic devices. High precision, programmable pumps deliver pulse-free flow (0.1-50 microLiters/min) or biomimetic (pulsating) flows in forward and reverse modes.

Several microscopes can be used:

• A stereo microscope (10-63X), camera and digital image capture software can document flow parameters. 
• An upright microscope with brightfield or fluorescence (2.5X - 50X)
• An inverted microscope with brightfield or fluorescence.

The Leica CPD300 is a small footprint, easy to use critical point dryer. The touch screen makes editing and running simple and fast. The tool has a maximum substrate size of 2" which minimizes the amount of solvent used and decreases the cycle time.

Critical point drying apparatus is typically used after HF-release of a micro electro mechanical systems (MEMS) device to prevent stiction in the device. Drying MEMS in air or under vacuum can drastically alter their structures or even destroy them completely. They must therefore be dried by a gentler method. One well-known method is "Critical Point Drying". The surface tension of the water, isopropanol or acetone in a micro device at the point at which it changes from the liquid phase to the gaseous phase can destroy the device through capillary forces.

DISCO is a dicing saw capable of handling up to 8 inch substrates with a thickness of up to 1.25 mm. Applications that have benefited from the DISCO approach include the dicing of silicon, bonded Si wafers, and all types of glasses. Please contact the staff for details.

The FUJIFILM-Dimatix inkjet printer prints a range of fluids in non-contact mode. It uses disposable MEMS piezo drop-on-demand print cartridges. The printer features drop visualization, tunable jetting controls for each of the 16 nozzles, and a visual registration/alignment system. Dispensed drop sizes are 1, 5 or 10 pL with a placement accuracy of 10-20 µm. Particles smaller than 500 nanometers can be printed. Substrates can be rigid or flexible and up to 8 x 12 inches. A UV lamp can be attached to the print carriage for curing UV inks.

FlipScribe scribes without any touch to the top of the sample. It integrates a robust diamond scribe into a sample platform with a fence guide design. Time required to align and scribe is about 1 minute. It allows users to accurately position the scribe mark relative to features on the front side, visualized either by eye or with a user-supplied high magnification microscope. FlipScribe also offers a quick method for cleanly downsizing large samples, with a "scribe stope" to allow the operator to define the length of the scribe.

A Hamatech wafer processer has been converted for use as a post CMP brushcleaner. The tool uses a soft PVA sponge 'brush' to remove slurry particles from the wafer surface after polishing. Dilute ammonium hydroxide is added to improve the slurry particle removal. The wafers are then rinsed and spun dry.

The plasma generator can be used to temporarily charge surfaces or increase wetability of substrates for printing on the Dimatix inkjet printer. A plasma is generated from room air (ozone). No other gases are available at this time. The plasma generator is available to treat other surfaces, including enhancing the wetability of printing substrates. 

The plasma generator can be used to temporarily charge surfaces or increase wetability of substrates. A plasma is generated from room air (ozone). No other gases are available at this time. 

This oven is for curing at any temperature (35 - 200°C). it does NOT have vacuum capability.

The oven is part of the PDMS casting station which includes Sylgard 184, low-temperature vacuum ovens and a high-temperature oven (up to 200°C), a vacuum jar, scale and a plasma generator for casting & assembling PDMS-based fluidic devices. 

The CRC Hot Press can be used for embossing plastic substrates using patterned templates. The tool can give up to 1600 lbf (7000 N) and can heat up to 200°C (390°F).

This is a Wire bonding system used to make electrical connections between the bonding pads on chips, and the gold bonding pads on a chip carrier, or package. It uses .001 inch Gold wire with a combination of ultrasonics at the bonding tip, and heat on the device to make these connections. An electronic flame-0ff is used to melt a ball on the end of the wire which makes the first bond. The second bond can be made in any direction from the first bond.. The device to be bonded must be thermally coupled to the stage, and heated to about 170 degrees C.

The hood consists of a stainless steel heated tank for the exclusive use of KOH - potassium hydroxide. The bath has a recirculation pump and filter and also ultrasonics may be used to enhance uniformity. Potassium Hydroxide (KOH) is used for selective crystallographic etching of silicon. For example, KOH will preferentially etch the <100> plane of silicon 400x faster than the <111> plane. This creates a V-etch or pyramidal cavity. The dimensions and geometry of which are dependent upon the etch mask aperture and wafers crystal orientation.

The Laurel spinner is a small stand-alone spinner, It is operated in the solvent hood in 224 Duffield. The most common use is to spin PDMS or Sigmacoat onto 4-inch wafers. 25-75 mm Corning glass slides and 100-mm petri dishes have also been spun in the tool. No larger substrates will fit. 

The Logitech Orbis is a CMP tool capable of polishing 4 and 6 inch whole wafers. It can do automatic multistep polishing processes with diamond disk pad conditioning to maintain etch rates stability. The tool can be used for planarization or for damascene polishing of silicon oxide, silicon nitride, polysilicon, copper, tungsten, and other various metals. The CMP Primer, available below, describes the basics of CMP and covers the terminology of the process. If you are considering using CMP in your process please review the document and contact the tool manager early in your planning.

This oven is for curing plastics at low temperatures (35 - 60°C). A vacuum of 15- 20 mmHg can be applied if needed using house vacuum.

The oven is part of the PDMS casting station which includes Sylgard 184, low-temperature vacuum ovens and a high-temperature oven (up to 200 C), a vacuum jar, scale and a plasma generator for casting &assembing PDMS-based fluidic devices. 

This oven is for curing plastics at low temperatures (35 - 60°C). A vacuum of 15- 20 mmHg can be applied if needed using house vacuum.

The oven is part of the PDMS casting station which includes Sylgard 184, low-temperature vacuum ovens and a high-temperature oven (up to 200 C), a vacuum jar, scale and a plasma generator for casting & assembling PDMS-based fluidic devices. 

This oven is primarily for pre-baking SUEX/ADEX at 65°C. For other applications, contact the tool manager(s).

The micro drill is a custom made drill that is configured for 3", 4", and 6" wafers as well as glass slides. The drill is capable of drilling silicon, quartz, or glass with diamond coated micro drills. With three collets holding drill shanks from 0.040" to 1/8", it allows a variety of drill sizes ranging from 0.006" (~150 µm) to 0.065" (1650 µm).

Although the actual size of the finished hole is 60 - 70% larger than the drill, the micro drill is a quick and efficient method for through hole making for microfluidic devices. This tool is located in Room 224.

The large surface-area-to-volume ratios of surface and bulk micromachined micro and nanomechanical structures can cause unintentional adhesion of device components, referred to as stiction. Stiction occurs when restoring forces are unable to overcome interfacial forces such as capillary, van der Waals and electrostatic attractions. This results in permanent adhesion of device components to undesired surfaces. ConsequentlyNov 19, anti-stiction coatings for micro and nanoelectromechanical systems (MEMS and NEMS, respectively) and information technology devices (e.g.

The ObJet30 Pro prints proprietary UV-curable polymers that mimic acrylic or polypropylene. Devices are printed as "slices" or z-steps of 28 microns for most model polymers, or 16 microns for VeroClear. A support polymer is printed in the empty spaces that can be removed by water washing or physical picking. Bring 3D CAD as .STL files. The CNF provides AutoDesk Inventor Professional 2014 in the CAD room.

The FLIPCHIP,  FINEPLACER pico ma uses a precision optical system to align patterns on a small chip ( up to 20 x 20 mm) over patterns on a substrate (up to 100 x 100 mm, ). Alignment and placement  accuracy is 5 microns. The two devices are then pressed together with a force, up to a maximum of 20 N (4.5 lb.). Temperature profiles (up to 450 deg. C) for the substrate support and for the chip holder are programmable for solder re-flow, or solder paste.  A fiber optic UV source is also available for UV curing adhesives.

The AG Heatpulse 610 uses high intensity, visible radiation to heat samples for short periods (1-600 seconds) at precisely controlled temperatures. The steady state temperature range is from 400-1150 C and the heating rate is variable from 1-200 C per second. This is an atmospheric pressure system with limited capability for modification of annealing ambient with oxygen, argon, nitrogen, or forming gas (5% H2 in Ar).

The AG Heatpulse 610 uses high intensity, visible radiation to heat samples for short periods (1-600 seconds) at precisely controlled temperatures. The steady state temperature range is from 400-1150 C and the heating rate is variable from 1-200 C per second. This is an atmospheric pressure system with limited capability for modification of annealing ambient with oxygen, argon, nitrogen, or forming gas (5% H2 in Ar).

The Suss SB8e VAC substrate bonder is universal tool for bonding proses for micro-electro-mechanical system applications such as Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding and Thermal Compression Bonding. After Alignment the substrate stack are either mechanically clamped using the transport fixture or later-welded for further processing in the tool chamber. This tool can sustain wafers up-to 150mm. It can vacuum down to 5x10e-5 mbar with an overpressure up-to3 bar. The bonding process takes place under a controlled environment.

The Universal Laser Systems VersaLaser VLS3.50 is a CO2 laser that emits in the infrared spectrum to cut or etch patterns by vaporizing the substrate. The tool is equipped with optics that focus to spot sizes of 25.4 or 127 microns. The tool accommodates substrates up to 24 x 16 inches and several inches thick.

A wire bonder is used to connect the micron-scale pads of your device to the pads, or leads, in a package. This wedge-wedge ultrasonic type wire bonder (aka, wedge bonder) is currently being used with 1.25 mil aluminum wire. Minimum practical bond pad size is 100 microns square. It is now equiped with a Trinocular Stereo microscope, with TV camera, and viewing screen.

The tool is now located in Phillips Hall 154