Area Trainings

Photolithography tool access requirements

1. General photolithography training, online and in-person: see below.
2. Tool-specific training: refer to the tool's page.

1. General photolithography training

This training covers:

• Resist fundamentals.
• Use of spinners, priming and coating substrates.
• Baking resist on hot plates.
• Edge bead and resist removal.
• Inspecting resist and measuring thickness and uniformity.
• The hot strip bath.
• Hamatech wafer processors.

For the online part of this training, go to Workday Learning and watch:

RSRCH - CNF - General Photolithography Overview Video Training

Additionally, if you wish to use Class 2 materials (SU-8, LOR, PGMI, Omnicoat), watch:

RSRCH - CNF - Class 2 Photolithography Training

Tests are OPEN BOOK.

IMPORTANT: the listed Area Resources documentation is REQUIRED READING.

For the in-person part of the general photolithography training, contact:

Sherri Ellis

Giovanni Sartorello

Garry Bordonaro

2. Tool training

The general photolithography training does not cover any exposure tools; each tool has a separate training. All tools require IN-PERSON training by STAFF.  Please contact the tool manager. Refer to the individual tool pages for details.

General photolithography training (both online on Workday and in person) is a prerequisite for e-beam training. Please complete it first, then email ebeam (at) cnf.cornell.edu to request e-beam training.

Training for the furnace area covers the pre-furnace MOS clean, atmospheric and LPCVD processes. It is scheduled on a need basis, please email the tool manager for training requests. Include MOS area training in the subject header. You will be notified when the next scheduled training will be by email.