General photolithography training (both online on Workday and in person) is a prerequisite for e-beam training. Please complete it first, then email ebeam (at) cnf.cornell.edu to request e-beam training.
Tools for coating, exposing, and developing wafers utilizing advanced electron beam lithography for minimum feature sizes.
Hot plates for use in baking resist for ebeam lithography
Three manual spinners are provided for spin coating substrates with electron beam resists. Substrates up to 300 mm diameter can be coated.
The JEOL 6300 is a high resolution 100KeV electron beam lithography system.
The unique capability of the JEOL 6300 is that a fifth lens can be used to get a smaller beam spot size and write sub-10 nm features. This is the high resolution writing mode. Writing without the 5th lens in 4th lens mode is called the high speed writing mode.
The tool can accommodate pieces as small as 5mm up to 150mm wafers.
When should I use the JEOL 9500 or the JEOL 6300?
The JEOL JBX-9500FS Electron Beam Lithography System can load substrates ranging from 10 mm pieces up to 300 mm wafers and write features less than 10 nm in size. It has a 100 kV accelerating voltage, a 100 MHz clock and a 1 mm × 1 mm write field.
The Nabity system turns an SEM into a simple ebeam system. The hardware takes control of the deflection system on the SEM and can then be used to expose patterns in resist. This is particularly useful when there is a need for low energy exposures. The tool is very manual, as opposed to the fully automated JEOL systems, and the calibrations are very primitive.
Please talk to staff to determine whether the Nabity is the best choice for your project.