ABM's High Resolution Mask Aligner is a very versatile instrument with interchangeable light sources which allow Near-UV (405-365 nm) as well as Mid- and Deep-UV (254 nm, 220 nm) exposures in proximity (non-contact) or contact (soft & hard) modes. The exposure can cover an area 200 mm in diameter. The bottom-mount mask system accommodates masks up to 9 inches square and substrates from small chips to wafers up to 200 mm. The alignment tooling system also features an air-bearing substrate-to-mask planarization system for wedge-error compensation.
General Photolithography training is offered each Tuesday at 1:30PM. Meet in the Class I Spinner room. You will learn how to spin and bake photoresist.
This training does not cover any exposure tools -- each tool has a separate training. Contact the tool manager for scheduling training on individual photolithography tools.
You may also wish to view the training videos from the 2004 Nanocourses. These videos are available in CULearn as course RSRCH - CNF - PHOTOL101 - General Pholithography Training.
Equipment for mask making, resist coating, exposing, developing, UV curing and stripping your substrates.