ABM's High Resolution Mask Aligner is a very versatile instrument with interchangeable light sources which allow Near-UV (405-365 nm) as well as Mid- and Deep-UV (254 nm, 220 nm) exposures in proximity (non-contact) or contact (soft & hard) modes. The exposure can cover an area 200 mm in diameter. The bottom-mount mask system accommodates masks up to 9 inches square and substrates from small chips to wafers up to 200 mm. The alignment tooling system also features an air-bearing substrate-to-mask planarization system for wedge-error compensation.
Web-based Training. Sign up for: RSRCH - CNF - General Photolithography Overview Video Training
The General Photolithography Training Video is an overview of CNF's Photolithography facilities. You will learn the basics of Photolithography.
Tests are OPEN BOOK.
IMPORTANT: the listed Area Resources documentation is REQUIRED READING.
This training does not cover any exposure tools -- each tool has a separate training. Contact the tool manager for scheduling training on individual Photolithography tools.
Class II Photolithography Training (Web-based training):
Equipment for Mask Making, Photoresist Coating, Exposing, Developing, UV Curing and Stripping of your substrates.
Note that Class II Material Photolithography requires separate training and is performed in a separate room.