Training for the furnace area covers the pre-furnace MOS clean, atmospheric and LPCVD processes. It is scheduled on a need basis, please email the tool manager for training requests. Include MOS area training in the subject header. You will be notified when the next scheduled training will be by email.

Description

Furnaces for growing silicon oxide and depositing polysilicon, silicon nitride, and silicon oxide as well as processes for cleaning the wafers before deposition.

Boron Doping - D1

The Boron Doping Furnace is an atmospheric furnace with a 40” flat zone capable of processing up to 6” diameter wafers. The furnace tube is configured for utilizing solid source wafers for silicon doping. The furnace is restricted to silicon materials

CMOS N+ Polysilicon - D3

The CMOS N+ LPCVD Polysilicon Furnace is a low pressure CVD furnace with a 40” flat zone capable of processing up to 6” diameter wafers. Process gases available are SiH4, He/PH3 mix for in-situ doping, and HCL for cleaning. Samples are restricted to silicon based materials only and CMOS restricted tools and films.

General Material Anneal 1 - A1

The Anneal 1 Furnace is an atmospheric furnace with a 42” flat zone capable of processing up to 6” diameter wafers. The furnace tube is equipped with N2 gas for inert ambient processing, H2 for forming gas mixtures with N2, and O2 for dry oxidation with or without HCL. Most sample materials are accommodated.

LPCVD CMOS Nitride - E4

The LPCVD CMOS Silicon Nitride furnace is a low pressure CVD furnace with a 40” flat zone capable of processing up to 6” diameter wafers. Process gases used are SiH2Cl2, NH3, and N2O. CVD silicon nitride films with controlled stress and high temperature oxide (HTO) can be deposited. Samples are restricted to silicon based materials only and CMOS specific tool and film limitations.

LPCVD LTO - B3

The LPCVD Low Temperature Oxide furnace is a low pressure CVD furnace with a 40” flat zone capable of processing up to 6” diameter wafers. Process gases used are SiH4 and O2. Samples are restricted to silicon based materials only.

LPCVD Nitride - B4

The LPCVD Silicon Nitride furnace is a low pressure CVD furnace with a 40” flat zone capable of processing up to 6” diameter wafers. Process gases used are SiH2Cl2, NH3, and N2O. CVD silicon nitride films with controlled stress and high temperature oxide (HTO) can be deposited. Samples are restricted to silicon based materials only.

MOS Clean Anneal 2 - B1

The Anneal 2 Furnace is an atmospheric furnace with a 40” flat zone capable of processing up to 6” diameter wafers. The furnace tube is equipped with N2 and Ar gas for inert ambient processing, H2 for forming gas mixtures, and O2 for dry oxidation with or without HCL. Samples are restricted to silicon based materials only.

MOS Clean Hoods

The hot process area has two wet decks for RCA cleaning of substrates prior to loading into the furnaces. Dedicated dump rinsers with spin rinse dryers give 30 minute clean times for wafers. A HF dip is available for removal of native oxides prior to deposition. The tanks are sized to handle a full boat of 100 mm wafers.

The RCA clean is for Silicon wafers only.

MOS Metal Anneal 3 - C1

The Anneal 3 Furnace is an atmospheric furnace with a 40” flat zone capable of processing up to 6” diameter wafers. The furnace tube is equipped with N2 and Ar gas for inert ambient processing, H2 for forming gas mixtures, and O2 for dry oxidation with or without HCL. Samples are restricted to silicon based materials and a limited set of approved metal films.

MOS Metal Anneal 4 - C2

The Anneal 4 Furnace is an atmospheric furnace with a 40” flat zone capable of processing up to 6” diameter wafers. The furnace tube is equipped with N2 and Ar gas for inert ambient processing, H2 for forming gas mixtures, and O2 for dry oxidation with or without HCL. Samples are restricted to silicon based materials and a limited set of approved metal films.

N+/P+ Polysilicon - C4

The LPCVD Polysilicon Furnace is a low pressure CVD furnace with a 40” flat zone capable of processing up to 6” diameter wafers. Process gases available are SiH4, N2/PH3 and N2/B2H6 mixes for insitu doping, HCL for cleaning. Samples are restricted to silicon based materials only.

Phosphorus Doping - D2

The Phosphorus Doping Furnace is an atmospheric furnace with a 40” flat zone capable of processing up to 6” diameter wafers. The furnace tube is configured for utilizing solid source wafers for silicon doping. The furnace is restricted to silicon materials.

TFT LPCVD LTO410 - A3

The TFT Low Temperature Oxide furnace is a low pressure CVD furnace with a 40” flat zone capable of processing up to 6” diameter wafers. Process gases used are SiH4 and O2 for silane base oxides and diethysilane (LTO410) for liquid source based oxide. Samples are restricted to silicon and TFT compatible glass materials only.

TFT Polysilicon - A4

The TFT N+/P+ Polysilicon Furnace is an atmospheric furnace with a 42” flat zone capable of processing up to 6” diameter wafers. Process gases available are SiH4, N2/PH3 and N2/B2H6 mixes for insitu doping, HCL for cleaning, and NH3 for silane based nitride films. Samples are restricted to silicon and TFT compatible glass materials only.

TFT Wet/Dry Oxide - A2

The TFT Oxide Furnace is an atmospheric furnace with a 42” flat zone capable of processing up to 6” diameter wafers. The furnace tube is equipped with an external torch for pyrogenic wet oxidation,O2 for dry oxidation and O2/inert mixtures, as well as an N2 anneal ambient. Samples are restricted to silicon or TFT based materials only.

Wet/Dry Oxide - B2

The Thermal Oxidation Furnace is an atmospheric furnace with a 40” flat zone capable of processing up to 6” diameter wafers. The furnace tube is equipped with an external torch for pyrogenic wet oxidation, high and low O2 flow controllers for dry oxidation and O2/inert mixtures, as well as N2 and Ar anneal ambient. Samples are restricted to silicon based materials only.