Description

Tools for packaging of devices as well as other miscellaneous processing tools.

CorSolutions Microfluidic Probe Station (2nd Floor)

This fluidic probe station makes quick, non-permanent, compression connections to microfluidic devices. High precision, programmable pumps deliver pulse-free flow (0.1-50 microLiters/min) or biomimetic (pulsating) flows in forward and reverse modes.

Several microscopes can be used:

  • A stereo microscope (10-63X), camera and digital image capture software can document flow parameters. 
  • An upright microscope with brightfield or fluorescence (2.5X - 50X)
  • An inverted microscope with brightfield or fluorescence.

Critical Point Dryer - Tousimis

Critical point drying apparatus is typically used after HF-release of a micro electro mechanical systems (MEMS) device to prevent stiction in the device. Drying MEMS in air or under vacuum can drastically alter their structures or even destroy them completely. They must therefore be dried by a gentler method. One well-known method is "Critical Point Drying". The surface tension of the water, isopropanol or acetone in a micro device at the point at which it changes from the liquid phase to the gaseous phase can destroy the device through capillary forces.

Dicing Saw - DISCO

DISCO is a dicing saw capable of handling up to 8 inch substrates with a thickness of up to 1.25 mm. Applications that have benefited from the DISCO approach include the dicing of silicon, bonded Si wafers, and all types of glasses. Please contact the staff for details.

FlipScribe Back Side Scribing Tool

FlipScribe scribes without any touch to the top of the sample. It integrates a robust diamond scribe into a sample platform with a fence guide design. Time required to align and scribe is about 1 minute. It allows users to accurately position the scribe mark relative to features on the front side, visualized either by eye or with a user-supplied high magnification microscope. FlipScribe also offers a quick method for cleanly downsizing large samples, with a "scribe stope" to allow the operator to define the length of the scribe.

K&S 4225 Gold Ball Bonder

The K&S 4225 is wirebonding system is used to make electrical connections between the bonding pads on chips and those on a chip carriers or packages. It uses .001 inch gold wire and a combination of ultrasound at the bonding tool (tip) and heat at the work holder. An electronic flame-off (EFO) is used to melt a gold ball on the end of the wire, which makes the first bond. The second bond can be made in any direction from the first bond using the mechanically-coupled control. The device to be bonded must be thermally coupled to the stage, which is heated to about 170°C.

KOH Hood and Bath

The hood consists of a stainless steel heated tank for the exclusive use of KOH - potassium hydroxide. The bath has a recirculation pump and filter and also ultrasonics may be used to enhance uniformity. Potassium Hydroxide (KOH) is used for selective crystallographic etching of silicon. For example, KOH will preferentially etch the <100> plane of silicon 400x faster than the <111> plane. This creates a V-etch or pyramidal cavity. The dimensions and geometry of which are dependent upon the etch mask aperture and wafers crystal orientation.

Logitech Orbis CMP

The Logitech Orbis is a CMP tool capable of polishing 4 and 6 inch whole wafers. It can do automatic multistep polishing processes with diamond disk pad conditioning to maintain etch rates stability. The tool can be used for planarization or for damascene polishing of silicon oxide, silicon nitride, polysilicon, copper, tungsten, and other various metals. The CMP Primer, available below, describes the basics of CMP and covers the terminology of the process. If you are considering using CMP in your process please review the document and contact the tool manager early in your planning.

Low-temp PDMS Vacuum Oven 1 (2nd Floor)

This oven is for curing plastics at low temperatures (35 - 60°C). A vacuum of 15- 20 mmHg can be applied if needed using house vacuum.

The oven is part of the PDMS casting station which includes Sylgard 184, low-temperature vacuum ovens and a high-temperature oven (up to 200 C), a vacuum jar, scale and a plasma generator for casting &assembing PDMS-based fluidic devices. 

Low-temp PDMS Vacuum Oven 2 (2nd Floor)

This oven is for curing plastics at low temperatures (35 - 60°C). A vacuum of 15- 20 mmHg can be applied if needed using house vacuum.

The oven is part of the PDMS casting station which includes Sylgard 184, low-temperature vacuum ovens and a high-temperature oven (up to 200 C), a vacuum jar, scale and a plasma generator for casting & assembling PDMS-based fluidic devices. 

Microdrill

The micro drill is a custom made drill that is configured for 3", 4", and 6" wafers as well as glass slides. The drill is capable of drilling silicon, quartz, or glass with diamond coated micro drills. With three collets holding drill shanks from 0.040" to 1/8", it allows a variety of drill sizes ranging from 0.006" (~150 µm) to 0.065" (1650 µm).

Although the actual size of the finished hole is 60 - 70% larger than the drill, the micro drill is a quick and efficient method for through hole making for microfluidic devices. This tool is located in Room 224.

MVD100

The large surface-area-to-volume ratios of surface and bulk micromachined micro and nanomechanical structures can cause unintentional adhesion of device components, referred to as stiction. Stiction occurs when restoring forces are unable to overcome interfacial forces such as capillary, van der Waals and electrostatic attractions. This results in permanent adhesion of device components to undesired surfaces. ConsequentlyNov 19, anti-stiction coatings for micro and nanoelectromechanical systems (MEMS and NEMS, respectively) and information technology devices (e.g.

Objet30 Pro 3D Printer

The ObJet30 Pro prints proprietary UV-curable polymers that mimic acrylic or polypropylene. Devices are printed as "slices" or z-steps of 28 microns for most model polymers, or 16 microns for VeroClear. A support polymer is printed in the empty spaces that can be removed by water washing or physical picking. Bring 3D CAD as .STL files. The CNF provides AutoDesk Inventor Professional 2014 in the CAD room.

Pico MA FinePlacer FlipChip Bonder

The FLIPCHIP,  FINEPLACER pico ma uses a precision optical system to align patterns on a small chip ( up to 20 x 20 mm) over patterns on a substrate (up to 100 x 100 mm, ). Alignment and placement  accuracy is 5 microns. The two devices are then pressed together with a force, up to a maximum of 20 N (4.5 lb.). Temperature profiles (up to 450 deg. C) for the substrate support and for the chip holder are programmable for solder re-flow, or solder paste.  A fiber optic UV source is also available for UV curing adhesives.

RTA - AG610a

The AG Heatpulse 610 uses high intensity, visible radiation to heat samples for short periods (1-600 seconds) at precisely controlled temperatures. The steady state temperature range is from 400-1150 C and the heating rate is variable from 1-200 C per second. This is an atmospheric pressure system with limited capability for modification of annealing ambient with oxygen, argon, nitrogen, or forming gas (5% H2 in Ar).

RTA - AG610b

The AG Heatpulse 610 uses high intensity, visible radiation to heat samples for short periods (1-600 seconds) at precisely controlled temperatures. The steady state temperature range is from 400-1150 C and the heating rate is variable from 1-200 C per second. This is an atmospheric pressure system with limited capability for modification of annealing ambient with oxygen, argon, nitrogen, or forming gas (5% H2 in Ar).

Suss SB8e Substrate Bonder

The Suss SB8e VAC substrate bonder is universal tool for bonding proses for micro-electro-mechanical system applications such as Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding and Thermal Compression Bonding. After Alignment the substrate stack are either mechanically clamped using the transport fixture or later-welded for further processing in the tool chamber. This tool can sustain wafers up-to 150mm. It can vacuum down to 5x10e-5 mbar with an overpressure up-to3 bar. The bonding process takes place under a controlled environment.

Westbond 7400A Ultrasonic Wire Bonder

A wire bonder is used to connect the micron-scale pads of your device to the pads, or leads, in a package. This wedge-wedge ultrasonic type wire bonder (aka, wedge bonder) is currently being used with 1.25 mil aluminum wire. Minimum practical bond pad size is 100 microns square. It is now equiped with a Trinocular Stereo microscope, with TV camera, and viewing screen.

The tool is now located in Phillips Hall 154