Description

Tools for packaging of devices as well as other miscellaneous processing tools.

Critical Point Dryer - Tousimis

Critical point drying apparatus is typically used after HF-release of a micro electro mechanical systems (MEMS) device to prevent stiction in the device. Drying MEMS in air or under vacuum can drastically alter their structures or even destroy them completely. They must therefore be dried by a gentler method. One well-known method is "Critical Point Drying". The surface tension of the water, isopropanol or acetone in a micro device at the point at which it changes from the liquid phase to the gaseous phase can destroy the device through capillary forces.

Dicing Saw - DISCO

DISCO is a dicing saw capable of handling up to 8 inch substrates with a thickness of up to 1.25 mm. Applications that have benefited from the DISCO approach include the dicing of silicon, bonded Si wafers, and all types of glasses. Please contact the staff for details.

Dimatix Printer

The FUJIFILM-Dimatix inkjet printer prints a range of fluids in non-contact mode. It uses disposable MEMS piezo drop-on-demand print cartridges. The printer features drop visualization, tunable jetting controls for each of the 16 nozzles, and a visual registration/alignment system. Dispensed drop sizes are 1 or 10 pL with a placement accuracy of 10-20 µm. Particles smaller than 500 nanometers can be printed. Substrates can be rigid or flexible and up to 8 x 12 inches. A UV lamp can be attached to the print carriage for curing UV inks.

Hot Press

The CRC Hot Press can be used for embossing plastic substrates using patterned templates. The tool can give up to 1600 lbf (7000 N) and can heat up to 200°C (390°F).

Ion Implant - Eaton

The Eaton NV-6200AV is a medium current Ion Implanter capable of implanting dopants at beam energies from 10 to 190 KEV. Currently Arsine, Phosphine, Boron Trifluoride, Carbon Dioxide, Argon and Helium are available for implant. The implanter is configured for 6" wafers but carrier wafers are available for implanting 4" wafers or pieces.

K&S Gold Ball Bonder

This is a Wire bonding system used to make electrical connections between the bonding pads on chips, and the gold bonding pads on a chip carrier, or package. It uses .001 inch Gold wire with a combination of ultrasonics at the bonding tip, and heat on the device to make these connections. An electronic flame-0ff is used to melt a ball on the end of the wire which makes the first bond. The second bond can be made in any direction from the first bond.. The device to be bonded must be thermally coupled to the stage, and heated to about 170 degrees C.

Logitech Orbis CMP

The Logitech Orbis is a CMP tool capable of polishing 4 and 6 inch whole wafers. It can do automatic multistep polishing processes with diamond disk pad conditioning to maintain etch rates stability. The tool can be used for planarization or for damascene polishing of silicon oxide, silicon nitride, polysilicon, copper, tungsten, and other various metals. The CMP Primer, available below, describes the basics of CMP and covers the terminology of the process. If you are considering using CMP in your process please review the document and contact the tool manager early in your planning.

Microdrill

The micro drill is a custom made drill that is configured for 3", 4", and 6" wafers as well as glass slides. The drill is capable of drilling silicon, quartz, or glass with diamond coated micro drills. With three collets holding drill shanks from 0.040" to 1/8", it allows a variety of drill sizes ranging from 0.006" (~150 µm) to 0.065" (1650 µm).

Although the actual size of the finished hole is 60 - 70% larger than the drill, the micro drill is a quick and efficient method for through hole making for microfluidic devices. This tool is located in Room 224.

MVD100

The large surface-area-to-volume ratios of surface and bulk micromachined micro and nanomechanical structures can cause unintentional adhesion of device components, referred to as stiction. Stiction occurs when restoring forces are unable to overcome interfacial forces such as capillary, van der Waals and electrostatic attractions. This results in permanent adhesion of device components to undesired surfaces. ConsequentlyNov 19, anti-stiction coatings for micro and nanoelectromechanical systems (MEMS and NEMS, respectively) and information technology devices (e.g.

ObJet30 Pro 3D Printer

The ObJet30 Pro prints proprietary UV-curable polymers that mimic acrylic or polypropylene. Devices are printed as "slices" or z-steps of 28 microns for most model polymers, or 16 microns for VeroClear. A support polymer is printed in the empty spaces that can be removed by water washing or physical picking. Bring 3D CAD as .STL files. The CNF provides AutoDesk Inventor Professional 2014 in the CAD room.

PDMS Casting Station

The PDMS casting station is located in the CNF wet (biology) lab in Duffield 224. The station provides a vacuum oven that heats to 60 degrees C, a vacuum (dessication) jar, a scale, and a plasma generator for the casting and assembly of PDMS-based devices. PDMS (Sylgard 184), basic glass slides, cutting tools and mixing supplies are provided.

RTA - AG610 - General Metals

The AG Heatpulse 610 uses high intensity, visible radiation to heat samples for short periods (1-600 seconds) at precisely controlled temperatures. The steady state temperature range is from 400-1150 C and the heating rate is variable from 1-200 C per second. This is an atmospheric pressure system with limited capability for modification of annealing ambient with oxygen, argon, nitrogen, or forming gas (5% H2 in Ar).

RTA - AG610 - Refractory Metals

The AG Heatpulse 610 uses high intensity, visible radiation to heat samples for short periods (1-600 seconds) at precisely controlled temperatures. The steady state temperature range is from 400-1150 C and the heating rate is variable from 1-200 C per second. This is an atmospheric pressure system with limited capability for modification of annealing ambient with oxygen, argon, nitrogen, or forming gas (5% H2 in Ar).

Suss SB8e Substrate Bonder

The Suss SB8e VAC substrate bonder is universal tool for bonding proses for micro-electro-mechanical system applications such as Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding and Thermal Compression Bonding. After Alignment the substrate stack are either mechanically clamped using the transport fixture or later-welded for further processing in the tool chamber. This tool can sustain wafers up-to 150mm. It can vacuum down to 5x10e-5 mbar with an overpressure up-to3 bar. The bonding process takes place under a controlled environment.

Versalaser Cutting/Engraving Tool

The Universal Laser Systems VersaLaser VLS3.50 is a CO2 laser that emits in the infrared spectrum to cut or etch patterns by vaporizing the substrate. The tool is equipped with optics that focus to spot sizes of 25.4 or 127 microns. The tool accommodates substrates up to 24 x 16 inches and several inches thick.

The laser is controlled by Corel Draw or AutoCAD plotting software. Designs are translated into varying depths, widths, and edge qualities. Cuts with microscale widths as small as 35-120 microns (depending on the substrate)can be achieved.

Westbond 7400A Ultrasonic Wire Bonder

A wire bonder is used to connect the micron-scale pads of your device to the pads, or leads, in a package. This wedge-wedge ultrasonic type wire bonder (aka, wedge bonder) is currently being used with 1.25 mil aluminum wire. Minimum practical bond pad size is 100 microns square. It is now equiped with a Trinocular Stereo microscope, with TV camera, and viewing screen.

The tool is now located in Room 228.