Metrology

Profilometry allows users to get a 2D trace of surface topographic features through contact with a stylus. The Dektak profilometer determines film thickness, feature heights in microfluidic devices, 3D-printed devices or feature depths in laser cut samples. It can also show the surface roughness of substrates.

The DektakXT is a stylus profilometer with 4 A repeatability. The tool is loaded with a 12.5 um radius of curvature diamond-tipped stylus. We have sample stages to accommodate wafer pieces, as well as full size wafers up to 200mm. The software gives us motorized stage translation and rotation, as well as sequencing for up to 200 sites. The Vision64 software can also use the tool measurements to create a 3D map of the scanned surface.

This profilometer is meant for those with advanced profilometry needs.

The F40 system is attached to a microscope for film thickness measurement from 20 nm to 20 microns with a measurement spot size ranging from 100 to 10 microns square. The use of the microscope allows you to make measurements on specific features of your pattern devices.

The F50 system can be used for measurements of thickness, refractive index(n), and dispersion(k), as well as wafer mapping of any of these properties from 20 nm up to 70 micron. The F50 is located in the photolithography suite in the CNF cleanroom and is equipped with a filter to enable measurement of photoresist films without exposing them.

The F50-EXR system can be used for measurements of thickness, refractive index(n), and dispersion(k), as well as wafer mapping of any of these properties from 30 nm up to 250 micron.

A film model must be available that gives the n & k of the film over the optical wavelength range of the tool (380 nm - 1700 nm for the F50-EXR). For new films, the Woollam Spectroscopic Ellipsometer can give a thorough analysis and generate the required data so that the faster FilMetrics can be used for thickness mapping and other measurements.

Mapping 4 point Probe system. 1mohm/sq to 200 Mohm/sq sheet resistance. 200mm wafers capable.

A laser scan technique is used to measure wafer surface curvature before, and after wafer processing. Two wavelengths (670 nm and 780 nm) are available to ensure adequate reflected signal from the wafer. The calculated change in curvature is then used to calculate the stress in the film. The wafer is scanned on a hot plate which can be programed for stress vs. temperature measurements.

The Zetasizer (Malvern Nano ZS) characterizes nanomaterials in a solution. It uses Dynamic Light Scattering to determine the polydispersity of a sample and measure particle charge, size, and molecular weight. Materials from 0.6 to 6,000 nm can be measured with an electrokinetic potential analysis from -150 to +150 megavolts. A size measurement can be taken with a sample from 12 to 500 microliters. An electrokinetic potential measurement requires a one-milliliter sample.

The NanoSight (Malvern NS300) uses the technology of Nanoparticle Tracking Analysis (NTA) to characterize nanoparticles from 30 to 800 nanometers in liquid. Each particle is individually and simultaneously analyzed by direct observation and measurement of diffusion events. A laser beam is passed through the sample chamber, and the particles in suspension scatter light so they can be easily visualized by the 20X magnification microscope and camera. The camera can take 30 frames per second and captures a video file of the particles.

The Metricon Model 2010/M Prism Coupler utilizes advanced optical waveguiding techniques to rapidly and accurately measure both the thickness and the refractive index/birefringence of dielectric and polymer films as well as refractive index of bulk materials. The 2010/M offers unique advantages over conventional refractometers and instruments based on ellipsometry or spectrophotometry:

Portable Refracto 30PX

Place a few drops of sample on the cell, push the button, and read the final result.

Stored in the cabinets in 201 Duffield.

A profilometer is a precision metrology tool used to measure surface characteristics in the micron to nanometer scale. It is an ideal tool for measuring step heights. This is useful for measuring film thickness, etch depth, surface roughness, wear-scar measurements. Many parameters of surface roughness and waviness can be measured. The P-7 is a stylus-based surface profiler, with motorized XY stage with vacuum hold down, and a wide range of scan parameter settings.

The Rame-Hart 500 contact angle goniomter/tensiometer is capable of measuring contact angle and determining the surface energy of a sample. Contact angle measurements are useful for determining the surface properties of a material. This can include a surface's wettability and its surface free energy. The contact angle can help to determine the cleanliness of a surface and to verify that a particular chemical modification has taken place.

The Schott IR Inspection Tool is a general all purpose semi-automatic inspection tool for front side, buried layers, and backside inspection. The machine can handle substrates size up to 200mm in Diameter.

Buried layers in bonded silicon wafers can be imaged with this tool due to its infrared camera. 

Currently a low-mag camera is operational. 

A Lucas Signatone SP4 4-pt probe and a Keithley 2100 multimeter are provided for measuring the resistivity of for soft films such as conductive polymers.

The VCA is able to measure the water contact angle on wafer surfaces up to 6 inch in diameter. It is a useful metrology tool for measuring the quality of surface treatments put down in the Applied Microstructures MVD100 tool.

The SV-10 has 2 sensor plates that are driven with electromagnetic force at the same frequency by vibrating at constant sine-wave vibration in reverse phase like a tuning- fork. It will measure the viscidity between the sensor plates and the sample fluid.

Spectroscopic ellipsometry is a noninvasive technique that measures the changes in the polarization state (Ψ and Δ) of light reflecting from a substrate. From these parameters, thickness as well as optical properties of thin films and bulk material are determined. Spectroscopic ellipsometry is used for characterization of all types of materials: dielectrics, semiconductors, metals, organics, multilayers, doped films and more.

Ellipsometry is a noninvasive technique that measures the changes in the polarization state (psi and delta) of light reflecting from a substrate. From these parameters, thickness as well as optical properties of thin films are determined. First, in the measurement mode, the polarization change is measured. Then a model based on the layered film stack is applied and respective data is generated. Comparison between the experimental and generated data is then made by utilizing fitting functions.

The NewView 7300 is a non-contact optical profilometer capable of producing highly accurate, 3D surface topography measurements. The 7300 rapidly measures heights from less than 1 micron up to 20 millimeters, with vertical resolution to 0.1 nm. It is ideally suited for inspecting step heights, MEMS devices, and many other applications. With the stitching option large areas can be measured and combined to form one image. It also has a stroboscopic measurement capability which will takes movies of moving structures like comb drives and oscillators.