K&S 4522 Gold Ball Bonder

The K&S 4522 is wirebonding system is used to make electrical connections between the bonding pads on chips and those on a chip carriers or packages. It uses .001 inch gold wire and a combination of ultrasound at the bonding tool (tip) and heat at the work holder. An electronic flame-off (EFO) is used to melt a gold ball on the end of the wire, which makes the first bond. The second bond can be made in any direction from the first bond using the mechanically-coupled control. The device to be bonded must be thermally coupled to the stage, which is heated to about 170°C.