For training, please contact the Tool Manager(s).

Compatibility:
Not Applicable
Additional Restrictions
  • Use gloves.
  • No dirty substrates, or materials prone to releasing particulate.
Manager
Giovanni Sartorello
TPT HB16 Semi-automatic Wire Bonder

The TPT HB16 is a semi-automatic wire bonder with wedge, ball, bump and ribbon bonding capability.

Capabilities
  • Gold and aluminum wire
  • Wedge, ball, bump and ribbon bonding (additional tools may be required.
Equipment Information Sheet