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Staff Information

Equipment Menu

  • Photolithography
  • Electron-Beam Lithography
  • Furnace Processing
  • Electrical Testing
  • Metrology
  • SEMS & Microscopes
  • Etching
  • Thin Film Deposition
  • Packaging & Misc Processing
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  • CM3FP - 3D Prototyping
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Mac McMurdy
Title
Thin Film Process Engineer
Email - Directory
mcmurdy@cnf.cornell.edu
Office Phone
607-254-4813
Manager for:
Dektak XT Profilometer
FleXus Film Stress Measurement
FlipScribe Back Side Scribing Tool
Hummer Au/Pd Sputtering System
K&S Gold Ball Bonder (2nd Floor)
Oxford 81 Etcher
Oxford 82 Etcher
P7 Profilometer
Pico MA FinePlacer FlipChip Bonder
Plasma-Therm Takachi ALE
Polaron Gold Sputtering System
Primaxx Vapor HF Etcher
PT720 Etcher
PT740 Etcher
Rudolph FTM
Westbond 7400A Ultrasonic Wire Bonder
YES Asher
YES EcoClean Asher
Backup for:
AFM - Veeco Icon
AJA Sputter Deposition
AJA Sputter Deposition - 2
AJA Sputter Deposition - 3
Arradiance ALD Gemstar-6
OEM Endeavor M1
Oxford ALD FlexAL
Plasma-Therm Takachi HDP-CVD
SAMCO UV-1 UV/Ozone
Trion Minilock III ICP Etcher
Veeco Savannah ALD
Zeiss Supra SEM
Zeiss Ultra SEM

Please acknowledge the CNF in your presentations, posters, and publications.

This material is based upon work supported by the National Science Foundation under Grant No. NNCI-2025233. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

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