Tool Location
111

For training, please contact the Tool Manager(s).

Compatibility:
1E - Silicon Based Materials and Select Dieletrics
Additional Restrictions
  • No metals allowed
  • 100mm wafers only
  • 5mm of resist must be removed from the edge of the wafer.
  • Pieces may be temporarily bonded to a carrier wafer with Cool Grease
Manager
Jeremy Clark
Backups:
Philip Schneider
Oxford Cobra for Dielectrics

This Oxford Cobra is an inductively coupled plasma based system that is configured for silicon-based dielectric etching. The system consists of one ICP process module connected to a single automated wafer transfer load lock. It is equipped with Helium backside cooling and a 10C electrode.

Equipment Information Sheet