Tool Location
102
Training
For training, please contact the Tool Manager(s).
Additional Restrictions
- Allowed samples include pieces and wafers up to 150 mm
Manager
Backups:
Body
This is a XeF2 based vapor phase etch system for isotropic and selective silicon etching.
XeF2 isotropic silicon etching is particularly well suited for MEMS applications. The XeF2 reaction with silicon is purely chemical and spontaneous (ie, plasmaless). XeF2 vapor phase etching exhibits nearly infinite selectivity of silicon to photoresist, SiO2, Si3N4, and aluminum. Being a vapor phase etchant, XeF2 avoids many common problems during release such as stiction,etc.