SubTitle
Oxford PlasmaLab 100 ICP System for Fluorine based deep SiO2/Quartz etching
Training

To schedule a training, please contact the Tool Manager(s).

Additional Restrictions
  • No high vapor pressure materials (lead, indium, ITO, etc.)
  • No Pyrex or Borofloat etching
  • Limited metals allowed - please discuss with tool manager (Ni not allowed as an etch mask)
  • 100mm wafers
  • Pieces may be mounted to Sapphire wafer with CoolGrease
Manager
Backups:
Body

The Oxford Plasmalab100 is an inductively coupled plasma based system that is configured for silicon based dielectric etching. The system consists of one ICP process module connected to a single automated wafer transfer load lock. It is equipped with He backside cooling and has a temperature controlled electrode.

Capabilities
  • Fluroinated gases: CHF3, CF4, CH2F2, C4F6, C4F8
  • Other gases: CO2, Ar, O2, N2, He
  • Materials: Thermal, ALD, PECVD, and LPCVD oxides and nitrides
  • Glasses: Quartz and Fused silica only- no Pyrex or Borofloat allowed