Hamatech Post CMP Brushcleaner
Additional Restrictions
- Whole wafers sized for available chucks only
Return to list of compatibility categories
Allowed | Not Allowed |
---|---|
Tool category 1/1E materials | No Glass Substrates |
Silicon Based Materials only |
No CNF Class A or Class B metals and oxides/compounds of (exposed or buried) (ie Magnesium, Zinc, Barium, Calcium) |
Si, SiC, SiO2 substrates | |
All Furnace grown or deposited films | |
PECVD Films | No Gold, Silver or Copper (Exposed or buried) |
ALD dieletric films | |
CNF Refractory Metals (ie Al, Ti,Ta,W,Pt,Mo,Cr,Ni) | No III/V Compound Semiconductors |
Nitrides and Oxides of above metals | No Organic/Biology Molecules prepared-with or without Salt buffers |
Cured organics and baked Photoresist |
Select III/V materials allowed- ask staff before proceeding!