PlasmaTherm 770 left chamber is the dedicated metal ICP etch chamber.

For training, please contact the Tool Manager(s).

Compatibility:
3 - Silicon, III-V Compound Semiconductor, Glass and Metal Category
Additional Restrictions
  • 4-inch wafers only.
  • Photoresist mask - edge bead must be removed (5mm ring) if using 4-inch wafers
  • Pieces should be mounted to sapphire wafer
  • Do not change recipes without staff approval
Manager
Tom Pennell
Backups:
Jeremy Clark
PT770

The PT770 is a dual chamber ICP system. The left chamber is dedicated to chlorine based metal etching.   

Capabilities
  • Load Locked sample introduction
  • Turbomolecular pumping
  • Microprocessor etch recipe control
  • metal etching in the left chamber(Al, AlSiCu, Cr, Ti, Al2O3, Ta, Nb, Mo, MoSi2, TiN, TaN, and AlN.
Equipment Information Sheet
Resources:
Etch Baseline Data
Location in Cleanroom