SubTitle
ICP System with Chlorine and Fluorine processes.
Training

For training, please contact the Tool Manager(s).

Additional Restrictions
  • No high vapor pressure materials (Pb, ITO, etc.)
  • No gold exposed to the plasma
  • Pieces should be mounted to sapphire carrier wafer (4)
Body

Trion Minilock III is an RIE/ICP system who purpose is to etch Chrome.

Capabilities

The system has both chlorinated and fluorinated gases and is capable of handling up to 8-inch wafers and 7" square plates.

Processes Available
  • Chrome etching (Cl/O2/Ar)
  • Polymer etching (O2/Ar)
  • SiO2 etching (CHF3/CF4/Ar)