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Tool Category 5: Class A and B Metals and Compounds
Allowed Not Allowed
Tool category 1/1E, 2, 3, and 4 materials  
Silicon Based Substrates and Films  
III/V compound Semiconductors  
Glass Substrates  
PECVD and ALD  Films  
Cured organics and baked Photoresist  
CNF Class A, B, and Refractory metals  
Exposed Gold, Silver, Copper  
Alkali and Alkaline Compounds  
Organic/Biology Molecules prepared-w/salt buffers  
High Vapor Pressure Materials (Mg, Ca, Zn)* * Some tool restrictions on high vapor pressure materials may apply
Soft organic materials  

 

High Vapor Pressure Metals and Compounds are materials that have a vapor pressure above 1e-6 Torr at 400 C.

ABM Contact Aligner

Additional Restrictions
  • 4" - 9" masks, up to 200mm wafers, up to 0.25" thick
  • Back of substrate must be CLEAN - NO RESIST on back

AFM - Veeco Icon

Additional Restrictions
  • 6 wafers or smaller
  • Magnetic pucks available for small pieces

ASML PAS 5500/300C DUV Wafer Stepper

Additional Restrictions
  • Standard SEMI spec wafers ONLY based on current tool configuration
  • Carrier wafers MUST be approved by Photolith staff
  • Back of substrate must be CLEAN - NO RESIST on back
  • Mask must be CLEAN - no resist or fingerprints

Bottle Washer

Additional Restrictions
  • NO RESIST OR POLYMER SOLUTION BOTTLES!
  • These bottles must first be rinsed with the appropriate solvents to remove the polymer before water rinsing.

CDE ResMap Resistivity 4-pt Probe

Additional Restrictions
  • Full size wafers up to 200mm can be processed. Pieces can be processed with staff assistance.
  • Semiconductors and metals only, no soft polymer materials, other materials with staff approval.

CHA Mark 50 E-beam Evaporator

Additional Restrictions
  • No High vapor pressure materials (Pb, Ca, Zn, Sn, etc.) on substrates or sources in the evaporator.
  • Only evaporate approved materials. Do Not evaporate sources materials not on the data sheet.
  • No oxide evaporation will be done in this tool.

Class II Resist Spinners (SU-8)

Additional Restrictions
  • NO WATER, acetone, isopropanol, or methanol in spinners
  • NO unapproved resists, solvents, or materials in spinners (see posted list of allowable materials)

Dektak 6M profilometer

Additional Restrictions
  • Hard substrates (glass, plastic, semiconductor materials) allowed
  • Soft substrates (polymers like PDMS) possibly allowed AFTER contacting tool manager.
  • Sample size: up to 150 mm substrates; up to 5 mm thick

Dimatix Printer (Second Floor)

Additional Restrictions
  • ALL inks must be pre-apporved by the tool manager.
  • NO LOW FLASH POINT INKS. See tool manager before printing. 

Edge Bead Removal System

Additional Restrictions
  • NO WATER in spinners unless posted
  • NO unapproved solvents in spinners (see list)
  • NO biomaterials
  • NO RESIST spinning (ONLY EDGE BEAD REMOVER)

Electroplating Hood - Au

Additional Restrictions
  • No flaking, peeling, or loose materials may be placed into the bath.
  • Nothing that generates particulates may be placed into the bath.
  • Only photoresist or polyimide may be used ask mask materials. These MUST be hardbaked before electroplating to prev

Electroplating Hood - Cu

Additional Restrictions
  • No flaking, peeling, or loose materials may be placed into the bath.
  • Nothing that generates particulates may be placed into the bath.
  • Only photoresist or polyimide may be used ask mask materials. These MUST be hardbaked before electroplating to prev

Electroplating Hood - Ni

Additional Restrictions
  • No loose or flaking material allowed in baths.
  • Photoresist must be hard baked before plating to prevent lifting.

FleXus Film Stress Measurement

Additional Restrictions
  • Whole wafers only
  • Wafer top surface must reflect a laser beam, without too much scatter.
  • Wafer/substrate material must be included in the Flexus software list of material data.

Gamma Automatic Coat-Develop Tool

Additional Restrictions
  • 100mm wafers standard, up to 200mm compatible
  • Other size wafers must be scheduled with the equipment owners
  • NO warped wafers
  • Backside of wafers must be free of contamination prior to placing in system

GCA 6300 DSW 5X g-line Wafer Stepper

Additional Restrictions
  • Substrate thickness must be matched to proper chuck thickness
  • Back of substrate must be CLEAN - NO RESIST on back
  • Mask must be CLEAN - no resist or fingerprints
  • Use Transparent/Opaque switch in proper mode (>2um SiO2, or glass, etc.)

GCA AutoStep 200 DSW i-line Wafer Stepper

Additional Restrictions
  • Standard 100mm wafers ONLY unless specifically trained
  • Back of substrate must be CLEAN - NO RESIST on back
  • Mask must be CLEAN - no resist or fingerprints

Hamatech Hot Piranha

Additional Restrictions
  • Whole wafers or masks sized for available chucks only
  • No thick resist or organic layer stripping - piranha etch to be used for stripping residual material only!
  • Check wafer for materials incompatible with cleaning chemistry to prevent substrate damage

Hitachi S-900 SEM

Additional Restrictions
  • Fully Baked Resist Only! - Samples should be cleaned and baked before imaging

Hot Press (2nd Floor)

Additional Restrictions
  • Do not place plastics directly on hot surfaces. Use glass slides or wafers to protect plastic from melting directly on the hotpress surface.

JEOL 6300

Additional Restrictions
  • Whole silicon wafers only - discuss pieces or other materials with managers.
  • Conductive path to ground - if substrate is insulating, talk to managers.
  • Fully baked resists only; do not load samples with unbaked resist or glue or anything that may degas.

JEOL 9500

Additional Restrictions
  • Fully baked resists only; do not load samples with unbaked resist or glue or anything that may degas.
  • Please review electron beam lithography training materials, in AFS, at shares - public - processes_from_cnf_staff - ElectronBeamLithography - TrainingMaterials (accessible on any general use PC or CNF Thin client at CNF)

Microdrill

Additional Restrictions
  • Only use wafer and piece sizes compatible to chucks

Nanostrip Tank

Additional Restrictions
  • No waxes or other thick organic films. If you are uncertain, check with staff before stripping substrates.
  • Teflon boats only!

Nikon L200 Eclipse Microscope

Additional Restrictions
  • Do not use wipes, which generate particles, on microscope stages. Place samples on microscope slides.

Objet30 Pro 3D Printer

Additional Restrictions
  • Choose from 3 supplied polymers (DurusWhite, VeroClear, or RGD525)
  • Use only water with Dawn dish soap to soak devices
  • MOS CLEAN furnaces
  • Silicon wafers , electronic grade SiC, or pure fused silica/quartz samples only
  • No glass substrates, compound semiconductors, etc.
  • No resists, polymers, or metals---exposed or unexposed
  • Only samples with MOS and PECVD films ar

Olympus MX-50 Microscope

Additional Restrictions
  • Do not use wipes, which generate particles, on microscope stages. Place samples on microscope slides.

Optical Microscopes - Other

Additional Restrictions
  • Do not use wipes, which generate particles, on microscope stages. Place samples on microscope slides.

Oxford ALD FlexAL

Additional Restrictions
  • Full size 100mm wafers (other wafer sizes up to 200mm can be accommodated with staff assistance).
  • Pieces can be processed with the use of a carrier wafer or plate.
  • Polymers and resist need to be fully cured and only run at process temperatures below

Oxford PECVD

Additional Restrictions
  • No general material restrictions
  • Resists or other polymers must be cured at 25C above the temperature of the hotplate.

P10 Profilometer

Additional Restrictions
  • Standard semiconductor manufacturing materials allowed. Contact machine manager about other materials.
  • Samples must be clean: no acid or base residues on top or back

P7 Profilometer

Additional Restrictions
  • Samples must be clean: No Acid or Base Residues on top or back.
  • Standard semiconductor manufacturing materials allowed. Contact machine manager about other materials.
  • No Objects greater than 150mm diameter or smaller then 10mmx10mm

Primaxx Vapor HF Etcher

Additional Restrictions
  • No resist allowed in tool.
  • no doped oxides (PSG, BPSG) allowed.
  • Use aluminum carrier plate for pieces.

PT720 Etcher

Additional Restrictions
  • Use sapphire carrier wafer for pieces
  • The PT720/740 is a class 5 category tool with few materials restrictions.

PT740 Etcher

Additional Restrictions
  • Use sapphire carrier wafer for pieces

RC8 spinner (Class I resists)

Additional Restrictions
  • Materials Allowed in this Spinner:
    • P-20, KMPR, SU-8 2000, SU-8 3000, Cyclopentanone, Cyclotene, AP 3000
  • No Acetone!
  • No IPA!
  • No Methanol!

RC8 spinner (Class II resists)

Additional Restrictions
  • Materials Allowed in this Spinner:
    • P-20, KMPR, SU-8 2000, SU-8 3000, Cyclopentanone, Cyclotene, AP 3000
  • No Acetone!
  • No IPA!
  • No Methanol!

Resist Hot Strip Bath

Additional Restrictions
  • Resist coated substrates only - NO lift-off processing
  • NO SU-8, Polyimide, LOR, Class 2 Materials
  • Holder must retain substrate - no loose material

RTA - AG610a

Additional Restrictions
  • No samples with resist, glue, metals, or anything that may degas
  • Calibrated for whole Silicon wafers
  • Discuss pieces or other materials with tool manager

Rudolph FTM

Additional Restrictions
  • You need to know the index of refraction of the film being measured
  • Measurement area is 2 X 6 mm
  • Film optical thickness must be between 300 and 5,000 nm

Schott IR Inspector

Additional Restrictions
  • Do not use tacky or wet chemistry on substrate while operating the tool.

Spin Rinse Dryers

Additional Restrictions
  • Use only cassettes designated on the door of the tool
  • Substrates must fit inside the designated cassette, no pieces
  • Do not load fragile substrates (membranes, Released MEMS devices)

SU-8 Hotplates

Additional Restrictions
  • Class 2 resists only (see sign on spinner hood)

Suss Backside Alignment Measurement

Additional Restrictions
  • Adhesives are not allowed (scotch tape, Kapton tape, glues,
  • epoxies, greases, etc are not allowed) in the chamber. Only use clips to secure substrates.

SUSS MA6-BA6 Contact Aligner

Additional Restrictions
  • 5" & 7" mask size, up to 150mm substrates size.
  • Backside of the substrate must be CLEAN - No Resist on the back.

SUSS MJB4 Contact Aligner

Additional Restrictions
  • 5" Mask size
  • Substrate size from about 5mm square to 100mm in diameter.
  • Backside of the substrate must be clean. No wet Resist.

Suss SB8e Substrate Bonder

Additional Restrictions
  • Only metals evaporated at the CNF are allowed in the tool.
  • Metal and other compression material can only be in the bonding interface
  • For running pieces check with tool manager before running the tool.

Zeiss Supra SEM

Additional Restrictions
  • Fully Baked Resist Only!
  • Samples should be cleaned and baked before imaging

Zeiss Ultra SEM

Additional Restrictions
  • Fully Baked Resist Only!
  • Samples should be cleaned and baked before imaging

Zygo Optical Profilometer

Additional Restrictions
  • No material restrictions.
  • Curved, sloped, and vertical edges may not scan properly.