5 - Class A and B Metals and Compounds

• 4" - 9" masks, up to 200mm wafers, up to 0.25" thick
• Back of substrate must be CLEAN - NO RESIST on back

• 6 wafers or smaller
• Magnetic pucks available for small pieces

• No films thicker than 50nm or 500 loops without permission of the tool manager
• Pieces, 100mm, and 150mm wafers allowed
• Polymers must be fully cured at least 25C above the deposition temperature

• Standard SEMI spec wafers ONLY based on current tool configuration
• Carrier wafers MUST be approved by Photolith staff
• Back of substrate must be CLEAN - NO RESIST on back
• Mask must be CLEAN - no resist or fingerprints

• NO RESIST OR POLYMER SOLUTION BOTTLES!
• These bottles must first be rinsed with the appropriate solvents to remove the polymer before water rinsing.

None

None

None

• No High vapor pressure materials (Pb, Ca, Zn, Sn, etc.) on substrates or sources in the evaporator.
• Only evaporate approved materials. Do Not evaporate sources materials not on the data sheet.
• No oxide evaporation will be done in this tool.

• Class 1 materials only (most positive resist, nLOF, i-line and DUV materials, P-20 primer).
• The backside of all substrates must be inspected and cleaned prior to baking.
• No low temperature materials.

• Class 1 materials only (most positive resist, nLOF, i-line and DUV materials, P-20 primer).
• NO WATER.
• No biomaterials.

• Class 2 materials only (SU-8, LOR, PGMI, LOL, KMPR, OmniCoat, Polyimide).
• The backside of all substrates must be inspected and cleaned prior to baking.

• Class 2 materials only (SU-8, LOR, PGMI, LOL, KMPR, OmniCoat, Polyimide).
• NO WATER and NO SOLVENTS (acetone, isopropanol, methanol, etc.). Acetone on a wipe may be used to clean chucks and around the spinner.
• No biomaterials.

• Aqueous solutions only (water, ethanol, proteins, salts, detergents, etc.)
• NO ORGANIC SOLVENTS ALLOWED.
• NO BIOSAFETY LEVEL-2 MATERIAL
  • NO HUMAN-DERIVED SAMPLES
  • NO PRIMATE_DERIVED SAMPLES
  • NO PATHOGENIC MICROBES (dead or alive)
  • NO MICROBE-DERIVED TOXINS

• No Biological Materials
• No acids or acetone
• Only materials that are compatible with alcohols

• No Biological Materials
• No acids or acetone
• Only materials that are compatible with alcohols

• Hard substrates (glass, plastic, semiconductor materials) allowed
• Soft substrates (polymers like PDMS) possibly allowed AFTER contacting tool manager.
• Sample size: up to 150 mm substrates; up to 5 mm thick

• Samples must be clean
• Resist must be fully cured

• No GaAs substrates allowed.

• None

• Use only approved ebeam lithography resists and solvents

• NO WATER in spinners unless posted
• NO unapproved solvents in spinners (see list)
• NO biomaterials
• NO RESIST spinning (ONLY EDGE BEAD REMOVER)

• No flaking, peeling, or loose materials may be placed into the bath.
• Nothing that generates particulates may be placed into the bath.
• Only photoresist or polyimide may be used ask mask materials. These MUST be hardbaked before electroplating to prev

• No flaking, peeling, or loose materials may be placed into the bath.
• Nothing that generates particulates may be placed into the bath.
• Only photoresist or polyimide may be used ask mask materials. These MUST be hardbaked before electroplating to prev

• No loose or flaking material allowed in baths.
• Photoresist must be hard baked before plating to prevent lifting.

• None

• None

• Whole wafers only
• Wafer top surface must reflect a laser beam, without too much scatter.
• Wafer/substrate material must be included in the Flexus software list of material data.

• 100mm wafers standard, up to 200mm compatible
• Other size wafers must be scheduled with the equipment owners
• NO warped wafers
• Backside of wafers must be free of contamination prior to placing in system

• Substrate thickness must be matched to proper chuck thickness
• Back of substrate must be CLEAN - NO RESIST on back
• Mask must be CLEAN - no resist or fingerprints
• Use Transparent/Opaque switch in proper mode (>2um SiO2, or glass, etc.)

• Standard 100mm wafers ONLY unless specifically trained
• Back of substrate must be CLEAN - NO RESIST on back
• Mask must be CLEAN - no resist or fingerprints

• For use with standard semiconductor process materials only

• Whole wafers or masks sized for available chucks only
• No thick resist or organic layer stripping - piranha etch to be used for stripping residual material only!
• Check wafer for materials incompatible with cleaning chemistry to prevent substrate damage

• Whole wafers or masks sized for available chucks only

• Whole wafers or masks sized for available chucks only

• Whole wafers or masks sized for available chucks only

• No flammable materials or liquids allowed
• No uncured PDMS allowed.

• No flammable materials or liquids allowed
• No uncured PDMS allowed.

• Masks Only - either 0.090" or 0.250" thick
• NO wafers, pieces or other substrates

• No substrates smaller than 5 mm x 5 mm, unless approved by staff.
• No substrates with: dirty or contaminated back side, unbaked resist, loose parts, particulating coatings, etc.

• USE GLASS DISHES ONLY. Never use plastic dishes above 60°C. Plastics will melt.
• Turn the oven OFF when finished.

None

• Do not place plastics directly on hot surfaces. Use glass slides or wafers to protect plastic from melting directly on the hotpress surface.

• Only for use on materials going into the SEM or e-beam lithography systems.

• 12" x 12" x 3" Substrate Tray

• Whole silicon wafers only - discuss pieces or other materials with managers.
• Conductive path to ground - if substrate is insulating, talk to managers.
• Fully baked resists only; do not load samples with unbaked resist or glue or anything that may degas.

• Fully baked resists only; do not load samples with unbaked resist or glue or anything that may degas.

• None

• Wear eye protection, face shield and thin nitrile gloves when using the spinner in the fume hood.

• Never exceed 60°C.
• Reset the oven to 60°C when finished.
• Use plastic petri dishes or glass containers that withstand 60°C.

• Never exceed 60°C.
• Reset the oven to 60°C when finished.
• Use plastic petri dishes or glass containers that withstand 60°C.

• All samples must be pre-approved by the tool manager.
• Work with samples derived from humans, non-human primates or infectious microbes must be coordinated with the tool manager.

• All samples must be pre-approved by the tool manager.
• Work with samples derived from humans, non-human primates or infectious microbes must be coordinated with the tool manager.

• Only use wafer and piece sizes compatible to chucks

• Never run gun up rapidly to 30 kV; start at 20 kV and increase gradually in small steps to avoid damage to the electron emitter.

• None

• No resin immersion printing except with standard resins.
• No oil immersion printing except with the provided oil.
• No user resins allowed unless approved by staff.

• No waxes or other thick organic films. If you are uncertain, check with staff before stripping substrates.
• Teflon boats only!

• Do not use wipes, which generate particles, on microscope stages. Place samples on microscope slides.

• Choose from 3 supplied polymers (DurusWhite, VeroClear, or RGD525)
• Use only water with Dawn dish soap to soak devices

• MOS CLEAN furnaces
• Silicon wafers , electronic grade SiC, or pure fused silica/quartz samples only
• No glass substrates, compound semiconductors, etc.
• No resists, polymers, or metals---exposed or unexposed
• Only samples with MOS and PECVD films ar

• Use only with samples loaded into the JEOL e-beam chucks

• Do not use wipes, which generate particles, on microscope stages. Place samples on microscope slides.

• No biosafety level-2 samples allowed (human cells, non-human primate cells, toxins or microbes that cause disease in humans)

• Do not use wipes, which generate particles, on microscope stages. Place samples on microscope slides.

• Do not use wipes, which generate particles, on microscope stages. Place samples on microscope slides.

• No films thicker than 50nm or 500 loops without permission of the tool managers
• No changing of recipes other than loop count without permission of the tool managers
• Full size 100mm wafers (other wafer sizes up to 200mm can be accommodated with staff assistance).
• Pieces can be processed with the use of the dedicated Aluminum carrier plate.
• Polymers and resist need to be fully cured and only run using 110C processes

• No general material restrictions
• Resists or other polymers must be cured at 25C above the temperature of the hotplate.

• Samples must be clean: No Acid or Base Residues on top or back.
• Standard semiconductor manufacturing materials allowed. Contact machine manager about other materials.
• No Objects greater than 150mm diameter or smaller then 10mmx10mm

• None

• None

• Only for use on materials going into the SEM or e-beam lithography systems.

• No resist allowed in tool.
• No doped oxides (PSG, BPSG) allowed.
• Use aluminum carrier plate for pieces.

• Use sapphire carrier wafer for pieces
• The PT720/740 is a class 5 category tool with few materials restrictions.

• Use sapphire carrier wafer for pieces

• None

• Resist coated substrates only - NO lift-off processing
• NO SU-8, Polyimide, LOR, Class 2 Materials
• Holder must retain substrate - no loose material

• No samples with resist, glue, metals, or anything that may degas
• Calibrated for whole Silicon wafers
• Discuss pieces or other materials with tool manager

• You need to know the index of refraction of the film being measured
• Measurement area is 2 X 6 mm
• Film optical thickness must be between 300 and 5,000 nm

• Do not use tacky or wet chemistry on substrate while operating the tool.

• None

• Use only cassettes designated on the door of the tool
• Substrates must fit inside the designated cassette, no pieces
• Do not load fragile substrates (membranes, Released MEMS devices)

• SUEX and ADEX only.

• Adhesives are not allowed (scotch tape, Kapton tape, glues,
• epoxies, greases, etc are not allowed) in the chamber. Only use clips to secure substrates.

• 5" & 7" mask size, up to 150mm substrates size.
• Backside of the substrate must be CLEAN - No Resist on the back.

• 5" Mask size
• Substrate size from about 5mm square to 100mm in diameter.
• Backside of the substrate must be clean. No wet Resist.

• Only metals evaporated at the CNF are allowed in the tool.
• Metal and other compression material can only be in the bonding interface
• For running pieces check with tool manager before running the tool.

• No high vapor pressure materials (Pb, ITO, etc.)
• No gold exposed to the plasma
• Pieces should be mounted to sapphire carrier wafer (4)

• None

None.

Some tool restrictions on high vapor pressure materials may apply.

• 10 mm pieces to 150 mm wafers

• Wafers up to 150 mm
• Pieces are allowed as well

• No low temperature materials

• No low temperature materials (No materials that melt below 500°C )

• No low temperature materials - 150°C Process!

• Fully Baked Resist Only!
• Samples should be cleaned and baked before imaging

• Fully Baked Resist Only!
• Samples should be cleaned and baked before imaging

• No material restrictions.
• Curved, sloped, and vertical edges may not scan properly.

• Sample sizes should be 1cm or less