SubTitle
Load-lock single wafer, AJA sputter tool for deposition of thin metallic and dielectric films
Tool Location
110
Training

To request a training/ target change, click here:

[CNF Sputter Tool] - Training/Target Change Request – Fill out form

If you're having issues accessing the above form, please email the tool owners with your request and information below:

  • For training requests
  1. Piece or full wafer
  2. What's the substrate material
  3. What material(s) do you wish to deposit?
  4. What materials will be on your sample at the time of deposition? Please provide all materials present, even if buried.
  • For target change requests
  1. Which tool(s) would you like the target(s) in?
  2. When was the last time you used the tool? (weeks/months)
  3. What target(s) would you like installed?
  4. When will the target(s) be needed? (Please specify a Monday for installation duration for the week)
  5. Do you need the target(s) for more than one week? and why?

General training is "hands-on" and will cover DC sputtering. Training takes 1 hour, which includes machine operation with a short film deposition. To avoid having to retrain on the machine, the AJA sputtering tool must be used within 1 week of training.

Advanced training consists of reactive Sputtering with O2 or N2.

Additional Restrictions
Body

A cryopumped sputter deposition system allows deposition of a variety of metals and dielectrics. A full target list is available below. Both RF and DC sputtering is available on this system. This is a single wafer load-lock tool capable of accommodating up to 6 inch wafers. With rotation during deposition, less than 1% uniformity is encountered over a 4 inch substrate.

Capabilities
  • RF and DC sources
  • Cryopumped to 2E-8 Torr
  • Capacity: Single substrate - load-lock
  • Mass flow control for Argon, Nitrogen, and Oxygen
  • Substrate rotation
  • RF Backsputter and RF in-situ substrate clean
Processes Available

Targets available (3 inch diameter) are: Al, Al+1%Si, Al+1%Si+1%Cu, Cr, Cu, MoSi, SiO2 (RF TARGET), Ti, TiW, W, Ta, Mo, Pt, Ge, Si, Nb

Process data consisting of grain structure, roughness, stress, deposition rates, and step coverage is provided in a printed manual near the AJA tool. Furthermore, Additional Resources (section below) includes a link to a pdf file of the process data.

Follow the target-changing guidelines when requesting targets. To request a target change, click here:

[CNF Sputter Tool] - Training/Target Change Request – Fill out form