For training, please contact the Tool Manager(s).

Training takes about 2 hours, usually in the afternoon, and is hands on.

Additional Restrictions
  • Call machine manager

A wire bonder is used to connect the micron-scale pads of your device to the pads, or leads, in a package. This wedge-wedge ultrasonic type wire bonder (aka, wedge bonder) is currently being used with 1.25 mil aluminum wire. Minimum practical bond pad size is 100 microns square. It is now equiped with a Trinocular Stereo microscope, with TV camera, and viewing screen.

The tool is now located in Phillips Hall 154