For training, please contact the Tool Manager(s).

Training takes about 2 hours, usually in the afternoon, and is hands on.

Compatibility:
5 - Class A and B Metals and Compounds
Additional Restrictions
  • Call machine manager
Manager
Mac McMurdy
Backups:
James Crawford
Daniel McCollister
Giovanni Sartorello
Westbond Bonder

A wire bonder is used to connect the micron-scale pads of your device to the pads, or leads, in a package. This wedge-wedge ultrasonic type wire bonder (aka, wedge bonder) is currently being used with 1.25 mil aluminum wire. Minimum practical bond pad size is 100 microns square. It is now equiped with a Trinocular Stereo microscope, with TV camera, and viewing screen.

The tool is now located in Phillips Hall 154

Equipment Information Sheet