OEM Aluminum Nitride Sputtering System
Tool Location
107

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Compatibility:
2 - Silicon Based Substrates and Select Refractory Metals
Additional Restrictions
  • CMOS compatible metals only at this time.
  • - Adhesives are not allowed (scotch tape, Kapton tape, glues, epoxies, greases, etc are not allowed) in the chamber. Only use clips to secure substrates.
  • Photoresist is not allowed in this tool due to the high temperatures of the deposition process.
Manager
Tom Pennell
Image of the OEM Endeavor M1 sputter deposition system in the CNF Cleanroom.

The OEM Endeavor M1 is capable of depositing highly crystalline C-Axis oriented aluminum nitride films. This unique design of this tool allows for deposition of 2 um AlN films in approximately 45 minutes in comparison do DC magnetron sputtering processes that would take many hours to achieve the same thickness.

The tool also has the ability to tune film stress via an integrated stress adjustment unit and by adjusting process parameters for released device application.

An external chamber heater is available for substrate degassing and heated deposition.

Processes Available

RF substrate preclean (200 Watts)

Aluminum Nitride (AlN) deposition

Equipment Information Sheet
Resources:
Image of the OEM Endeavor M1 tool in the CNF cleanroom.