SubTitle
AJA Orion 8 sputter deposition system. Ultra High Vacuum (UHV) deposition of critical materials with a variety of process capabilities.
Tool Location
107
Training

To request a training/ target change, click here:

[CNF Sputter Tool] - Training/Target Change Request – Fill out form

If you're having issues accessing the above form, please email the tool owners with your request and information below:

  • For training requests
  1. Piece or full wafer
  2. What's the substrate material
  3. What material(s) do you wish to deposit?
  4. What materials will be on your sample at the time of deposition? Please provide all materials present, even if buried.
  • For target change requests
  1. Which tool(s) would you like the target(s) in?
  2. When was the last time you used the tool? (weeks/months)
  3. What target(s) would you like installed?
  4. When will the target(s) be needed? (Please specify a Monday for installation duration for the week)
  5. Do you need the target(s) for more than one week? and why?
Additional Restrictions
  • No high vapor pressure substrates or films (ITO, Indium, Zinc, etc)
Body

The AJA 2 Orion 8 system at CNF has two DC power supplies, 4 3" diameter sputter guns for deposition of a variety of materials. The tool also has one 2" diameter sputter gun for deposition of magnetic materials. The tool also has an RF power supply for substrate cleaning prior to deposition. Current targets available in this tool include: Co, Ni, Al, Ti, Cu, Ta, Pt, Ru, TiW, W, Al/1%Si, AlSiCu and a variety of other materials. Multiple DC power supplies allows for co-sputtering of metallic materials including magnetic alloys. Multiple chamber gasses allow for reactive sputtering of a variety of materials. Heated deposition up to 800 Celsius allows for further tuning of material properties to desired outcomes.

Available gasses: Argon, Nitrogen and Oxygen

Capabilities

DC Sputtering

CoSputtering

Heated deposition up to 800 C

RF substrate cleaning/preparation

Turbo pumped loadlock

Cryo pumped main chamber.