SubTitle
AJA Orion 8 sputter deposition system. Ultra High Vacuum (UHV) deposition of critical materials with a variety of process capabilities.
Tool Location
107
Training

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Additional Restrictions
  • No high vapor pressure substrates or films (ITO, Indium, Zinc, etc)
Body

The AJA 2 Orion 8 system at CNF has two DC power supplies, 4 3" diameter sputter guns for deposition of a variety of materials. The tool also has one 2" diameter sputter gun for deposition of magnetic materials. The tool also has an RF power supply for substrate cleaning prior to deposition. Current targets available in this tool include: Co, Ni, Al, Ti, Cu, Ta, Pt, Ru, TiW, W, Al/1%Si, AlSiCu and a variety of other materials. Multiple DC power supplies allows for co-sputtering of metallic materials including magnetic alloys. Multiple chamber gasses allow for reactive sputtering of a variety of materials. Heated deposition up to 800 Celsius allows for further tuning of material properties to desired outcomes.

Available gasses: Argon, Nitrogen and Oxygen

Capabilities

DC Sputtering

CoSputtering

Heated deposition up to 800 C

RF substrate cleaning/preparation

Turbo pumped loadlock

Cryo pumped main chamber.