Tool Location
TBD
Training
For training, please contact the Tool Manager(s).
Compatibility:
Manager
Body
The Bonding System nanoBOND 200 is intended exclusively for manual bonding of individual wafers temporarily onto rigid carriers or other wafers.
The Debonding System nanoDEBOND 200 is intended exclusively to debond wafers, substrates or fragments from rigid carriers or other wafers under thermal influence.
Capabilities
Temporary thermal bonding of up to 200mm wafers.for backside grinding. Processing temperatures up to 200C. Mounting of pieces to wafers is also supported.
Processes Available
Temporary thermal bonding
Thermal slide debonding
Applications
Backside wafer thinning
Temporary carrier wafer mounting