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Tool Category 1:Restriced Silicon Based Materials Only
Allowed Not Allowed

Silicon Based Materials only

(Si, SiC, SiO2 substrates)

 No Evaporated, Sputtered, or Spin on Films
All Furnace grown or deposited films No ALD films
PECVD Films No Metal or Organic Films
  No Glass Substrates
  No III/V Compound Semiconductors
  No Deep Silicon Etched Samples (versaline, Unaxis)
  No Organic/Biology Molecules prepared-with or without Salt buffers

 

D3 - CMOS N+ Polysilicon

Additional Restrictions
  • MOS CLEAN required prior to use
  • Only use designated MOS holders, wands and tweezers

D4 - CMOS P+ Polysilicon

Additional Restrictions
  • MOS CLEAN required prior to use
  • Only use desginated MOS holders, wands and tweezers

E1 - CMOS Gate Oxide

Additional Restrictions
  • MOS CLEAN required prior to use
  • Only use MOS designated holders and wands

E2 - CMOS Wet Oxide

Additional Restrictions
  • MOS CLEAN required prior to use
  • Only use MOS designated holders, wands and tweezers

E3 - CMOS Undoped Poly

Additional Restrictions
  • MOS CLEAN required prior to use
  • Only use MOS designated holders, wands and tweezers

E4 - LPCVD CMOS Nitride

Additional Restrictions
  • MOS CLEAN required prior to use
  • Only use MOS designated holders, wands and tweezers