C&D Automated Liftoff Tool

The C&D liftoff tool is an automatic high pressure solvent dispense tool for the purpose of metal liftoff using standard photolithographic materials. The tool handles 100 and 150mm wafers only. Recipes typically work by a pre-wet fan nozzle dispense step using PGMEA, then high pressure dispense of PGMEA at up to 2500psi, a final font and backside rinse with IPA then spin dry. Typically 4-10 minutes per wafer depending on the recipe chosen. LOR+positive tone resist bilayer strategies work well as do negative tone nLOF type resists. Some work has been done with MMA/PMMA combinations as well.