Tool access requirements
1. General photolithography training, online and in-person.
2. Tool-specific training, online and in-person.
Please schedule training within a week of your first anticipated use.
1. General photolithography training
For the online part of general photolithography training, use Workday Learning:
- RSRCH - CNF - General Photolithography Overview Video Training
Additionally, find required and recommended reading here:
For in-person general photolithography training, contact:
2. Tool training
For the online part of contact aligner training, use Workday Learning:
- RSRCH - CNF - SUSS MA6-BA6 Contact Aligner
For in-person training, contact the tool manager.
This contact aligner uses 365-436 nm light to expose 100 mm wafers. The system features a video camera for alignment to patterns on the front or back side of the wafer. The versatile mask holder allows both round and square plates as masks.
- Contact lithography system
- Topside and Backside Alignment
- Flood field exposure
- Overlay accuracy to <1 um Substrate size 100mm
Alignment Mark Placement for Bottom Side Alignment (BSA):
- BSA objectives have a range of travel 24 to 95mm apart.
- The 100mm and 150mm substrate chucks have two rectangles for objectives to view the substrate
For 100mm Substrate Holder:
- Each rectangle is 3cm by 2cm center symmetric.
- Rectangles have diagonals of endpoints (-4.5,1), (-1.5, -1) & (4.5,1), (1.5,1)