As this tool is used during CMP, the training for this tool is done in connection with Strasbaugh 6EC training. Contact the tool staff if other training is required.
- Whole wafers sized for available chucks only
A Hamatech wafer processer has been converted for use as a post CMP brushcleaner. The tool uses a soft PVA sponge 'brush' to remove slurry particles from the wafer surface after polishing. Dilute ammonium hydroxide is added to improve the slurry particle removal. The wafers are then rinsed and spun dry.