For training, please contact the Tool Manager(s).
- No loose or flaking material allowed in baths.
- Photoresist must be hard baked before plating to prevent lifting.
Tanks and solutions are available for electroplating on substrates up to 6 inch wafers. Applications include electroplating copper for damascene wiring, electroplating into resist molds to form high aspect ratio structures, and deposition of thicker films (> 5 µm) on substrates.