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Aaron Windsor
Title
Thin Film Process Engineer
Email - Directory
windsor@cnf.cornell.edu
Office Phone
607-254-4831
Manager for:
AJA Ion Mill
Anatech Resist Strip
Angstrom E-Beam Evaporator
Angstrom-Q
CHA Evaporator
CHA Mark 50 E-beam Evaporator
General Chemistry Hoods
Glen 1000 Resist Strip
PT720 Etcher
PT740 Etcher
PVD 75 Sputter Deposition
SC4500 Even-Hour Evaporator
SC4500 Odd-Hour Evaporator
YES Asher
Backup for:
A1 - General Material Anneal 1
A2 - POCL3 Doping
A3 - Category 3 LPCVD Silicon Nitride
A4 - LPCVD Silicon Carbide
B1 - Category 1 MOS Clean Anneal 2
B2 - Wet/Dry Oxide
B3 - LPCVD LTO
B4 - LPCVD Silicon Nitride
C1- MOS Metal Anneal 3
C2 - MOS Metal Anneal 4
C3- LPCVD TEOS
C4 - N+/P+ Polysilicon
D1 - Solid Source Boron Doping
D2 - Solid Source Phosphorus Doping
D3 - CMOS N+ Polysilicon
D4 - CMOS P+ Polysilicon
Dishwasher-left
Dishwasher-right
E1 - CMOS Gate Oxide
E2 - CMOS Wet Oxide
E3 - CMOS Undoped Poly
E4 - LPCVD CMOS Nitride
Electroplating Hood - Au
Electroplating Hood - Cu
Electroplating Hood - Ni
Everbeing EB-6 DC Probe Station
Harrick Plasma Generator (2nd Floor)
KOH Hood and Bath
MOS Clean Bench & Tanks
MOS Clean Bench & Tanks - Category 3 Materials
Oxford 81 Etcher
Oxford 82 Etcher
Plasma-Therm Singulator
Plasma-Therm Takachi ALE
RTA - AG610a
RTA - AG610b
YES EcoClean Asher

Please acknowledge the CNF in your presentations, posters, and publications.

This material is based upon work supported by the National Science Foundation under Grant No. NNCI-2025233. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

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