SubTitle
Equipment for electroplating various metals
Training
For training, please contact the Tool Manager(s).
Compatibility:
Additional Restrictions
- No flaking, peeling, or loose materials may be placed into the bath.
- Nothing that generates particulates may be placed into the bath.
- Only photoresist or polyimide may be used ask mask materials. These MUST be hardbaked before electroplating to prev
Manager
Backups:
Body
Tanks and solutions are available for electroplating on substrates up to 6 inch wafers. Applications include electroplating copper for damascene wiring, electroplating into resist molds to form high aspect ratio structures, and deposition of thicker films (> 5 µm) on substrates.
Results
