Equipment for electroplating various metals

For training, please contact the Tool Manager(s).

Additional Restrictions
  • No flaking, peeling, or loose materials may be placed into the bath.
  • Nothing that generates particulates may be placed into the bath.
  • Only photoresist or polyimide may be used ask mask materials. These MUST be hardbaked before electroplating to prev

Tanks and solutions are available for electroplating on substrates up to 6 inch wafers. Applications include electroplating copper for damascene wiring, electroplating into resist molds to form high aspect ratio structures, and deposition of thicker films (> 5 ┬Ám) on substrates.