Tool access requirements
1. General photolithography training, online and in-person.
2. Tool-specific training, online and in-person.
Please schedule training within a week of your first anticipated use.
1. General photolithography training
For the online part of general photolithography training, use Workday Learning:
RSRCH - CNF - General Photolithography Overview Video Training
Additionally, find required and recommended reading here:
For in-person general photolithography training, contact:
2. Tool training
For the online part of GCA 5x g-line wafer stepper training, use Workday Learning.
Training part #1:
RSRCH - CNF - GCA 5X g-line Wafer Stepper Training Video
Training part #2:
RSRCH - CNF - Stepper Job Editing Video
Additionally, find tool-specific required and recommended reading in the "Resources" section below.
For in-person training, contact the tool manager.
Training for PROLITH lithography simulation software is also available in Workday Learning:
RSRCH - CNF - PROLITH Video Training
- Substrate thickness must be matched to proper chuck thickness
- Back of substrate must be CLEAN - NO RESIST on back
- Mask must be CLEAN - no resist or fingerprints
- Use Transparent/Opaque switch in proper mode (>2um SiO2, or glass, etc.)
This projection printer uses a g-line (436nm) lens column ( 0.30 N.A.) to provide a 5:1 reduction with a variable field size up to 15mm square. Minimum feature size is <0.9µm. The number and placement of the dies is programmable. Wafer size of 3" up to 150mm can be accommodated, as well as smaller pieces. A customized hand-held chuck system allows rapid change of substrate size. Registered alignment is typically <0.25µm. 5" x 0.090"-thick masks are used. This instrument can be easily converted to function as a GCA 3696 Photorepeater system for exposing photoresist coated glass plates up to 7".
- Step and repeat exposure system with laser-controlled stage motion
- Zeiss lens with 0.30 numerical aperture
- g-line (436 nm) exposure wavelength
- 15mm field size
- Resolution to 0.9 µm