SubTitle
GCA 6300 DSW 5X g-line Wafer Stepper
Training

Tool access requirements

1. General photolithography training, online and in-person.
2. Tool-specific training, online and in-person.

Please schedule training within a week of your first anticipated use.

1. General photolithography training

For the online part of general photolithography training, use CU Learn:

RSRCH - CNF - General Photolithography Overview Video Training (NetID)

RSRCH - CNF - General Photolithography Overview Video Training (GuestID)

Additionally, find required and recommended reading here:

CNF Users: Photolithography

For in-person general photolithography training, contact:

Giovanni Sartorello

Garry Bordonaro

2. Tool training

For the online part of GCA 5x g-line wafer stepper training, use CU Learn.

Training part #1:

RSRCH - CNF - GCA 5X g-line Wafer Stepper Training Video (NetID)

RSRCH - CNF - GCA 5X g-line Wafer Stepper Training Video (GuestID)

Training part #2:

RSRCH - CNF - Stepper Job Editing Video (NetID)

RSRCH - CNF - Stepper Job Editing Video (GuestID)

Additionally, find tool-specific required and recommended reading in the "Resources" section below.

For in-person training, contact the tool manager.


Training for PROLITH lithography simulation software is also available in CULearn:

RSRCH - CNF - PROLITH Video Training (NetID)

RSRCH - CNF - PROLITH Video Training (GuestID)

Additional Restrictions
  • Substrate thickness must be matched to proper chuck thickness
  • Back of substrate must be CLEAN - NO RESIST on back
  • Mask must be CLEAN - no resist or fingerprints
  • Use Transparent/Opaque switch in proper mode (>2um SiO2, or glass, etc.)
Body

This projection printer uses a g-line (436nm) lens column ( 0.30 N.A.) to provide a 5:1 reduction with a variable field size up to 15mm square. Minimum feature size is <0.9µm. The number and placement of the dies is programmable. Wafer size of 3" up to 150mm can be accommodated, as well as smaller pieces. A customized hand-held chuck system allows rapid change of substrate size. Registered alignment is typically <0.25µm. 5" x 0.090"-thick masks are used. This instrument can be easily converted to function as a GCA 3696 Photorepeater system for exposing photoresist coated glass plates up to 7".

Capabilities
  • Step and repeat exposure system with laser-controlled stage motion
  • Zeiss lens with 0.30 numerical aperture
  • g-line (436 nm) exposure wavelength
  • 15mm field size
  • Resolution to 0.9 µm