SubTitle
SUSS MicroTech MA/BA 6 Contact Aligner
Training

Web-based training. In CULearn, sign up for course:

Make sure before you request contact aligner training you have completed General Lithography Training.

Additional Restrictions
  • 5" & 7" mask size, up to 150mm substrates size.
  • Backside of the substrate must be CLEAN - No Resist on the back.
Body

This contact aligner uses 365-436 nm light to expose wafers up to 150 mm diameter. The system features a video camera for alignment to patterns on the front or back side of the wafer. The versatile mask holder allows both round and square plates as masks, and the sample plate accommodates small and odd-shaped substrates.

Capabilities
  • Contact lithography system
  • Topside and Backside Alignment
  • Flood field exposure
  • Overlay accuracy to <1 um
  • Substrate size up to 150mm

 

Alignment Mark Placement for Bottom Side Alignment (BSA):

  • BSA objectives have a range of travel 24 to 95mm apart.
  • The 100mm and 150mm substrate chucks have two rectangles for objectives to view the substrate.
  • For 100mm Substrate Holder:
  • Each rectangle is 3cm by 2cm center symmetric.
  • Rectangles have diagonals of endpoints (-4.5,1), (-1.5, -1) & (4.5,1), (1.5,1)
  • For 150mm Substrate Holder:
  • Each rectangle is 4.5cm by 2cm, center symmetric
  • Rectangles have diagonals of endpoints (-6.5,1), (-2,-1) & (6.5,1)
  •