For training, please contact the Tool Manager(s).

Additional Restrictions
  • No SU-8
  • III/V substrates allowed.

The YES EcoClean is a single wafer, downstream ICP stripper designed for photoresist and polyimide strip, descum, and inorganic substrate cleaning/surface modification. The remote ICP source produces a high-density oxygen plasma and confines any charged plasma species to the plasma chamber such that only charge-neutral species flow from the source to the substrate. The tool can process silicon and gallium arsenide wafers of 2", 3", 4", 5", 6", and 8" diameter. Tool capabilities include 3,000 W RF power and hot plate temperature up to 300 C for fast resist removal.