SubTitle
Vacuum oven for HMDS wafer priming
Training

Web-based Training: RSRCH - CNF - YES Vapor Prime Oven Training Video

Additional Restrictions
  • No low temperature materials - 150°C Process!
Body

The YES LP-III vacuum oven is used for HMDS vapor priming. Using hexamethyldisilazane (HMDS), the unit functions as a standard vacuum vapor priming oven. Clean wafers are dehydrated through a series of heated (150C) evacuations and dry N2 (nitrogen) refills. HMDS vapor then flows into the evacuated chamber forming a monolayer on the wafer surfaces. Vapor priming is used to improve the adhesion of the photoresist to the wafer.

Capabilities

HMDS vapor priming for improved adhesion of photoresist