For training, please contact the Tool Manager(s).
The Angstrom Electron-Beam Evaporator utilizes a load lock chamber for transferring substrates up to 150 mm in diameter into the process chamber without breaking vacuum. This enables users to perform high vacuum (10-8 to 10-9 Torr) depositions in a significantly shorter time. The turret has six, fifteen cubic centimeter pockets (twice the pocket volume of the hearths on both the odd/even hour evaporators). Angstrom Engineering’s Aeres software will give users full control of not only their depositions but substrate angle and rotation. This evaporator has an automated variable angle deposition (VAD) stage capable of both +/- 95° tilt and rotation motions for glancing angle deposition (GLAD) applications. The Angstrom evaporator will also be the first deposition tool at the CNF capable of in-situ ion beam substrate precleaning and ion assisted depositions. Other unique features on this new evaporator are a dual-crystal QCM rate sensor to extend the periods between breaking vacuum, substrate heating up to 400°C and shutters for both the source and substrate.