SubTitle
Leitz Film Thickness Measurement System
Training

For training, please contact the Tool Manager(s).

Additional Restrictions
Manager
Capabilities

The Leitz MV-SP Spectrophotometer uses optical methods to obtain quick, non-destructive thickness measurements of films from 10 nm to 15 µm thick. Measurement time is from 20 to 60 seconds and accuracy is quoted as plus-minus 3%. Measurements can be done inside geometries as small as four square micrometers (4 µm by 1 µm). Software is provided for measuring silicon dioxide, silicon nitride, polysilicon, polyimide, aluminum oxide, and photoresist. These films may be measured on silicon, aluminum, or III-V substrates. Programs are also provided for measuring the top layer of multiple film structures. In addition, other films and substrates can be added to the Leitz's library.