Tool access requirements
1. General photolithography training, online and in-person.
2. Tool-specific training, in-person.
Please schedule training within a week of your first anticipated use.
1. General photolithography training
For the online part of general photolithography training, use Workday Learning:
RSRCH - CNF - General Photolithography Overview Video Training
Additionally, find required and recommended reading here:
For in-person general photolithography training, contact:
2. Tool training
For in-person training, contact the tool manager(s).
- No substrates smaller than 5 mm x 5 mm
- No Class 2 materials (SU-8, LOR, PGMI, Omnicoat) until a dedicated stage insert is available.
The Heidelberg Instruments MLA 150 is a maskless aligner for direct-write lithography. Our machine is equipped with write mode I for feature sizes down to 0.6 micrometers and feature separation down to 0.8 micrometers. It has a gray scale exposure mode, both front and backside alignment capability, both 405 nm and 375 nm exposure wavelengths, field by field wafer mapping alignment, and many other capabilities. It accommodates substrates from 5 mm to 225 mm, with thicknesses up to 12mm. It performs all tasks of the DWL 66 it replaces, but faster and with better precision.
Alignment accuracy is 250 nm for local alignment, 500 nm for global alignment, and 1000 nm for backside alignment. The maximum writing speed is 285 mm²/min for both wavelengths.