Tool access requirements
1. General photolithography training, online and in-person.
2. Tool-specific training, in-person.
Please schedule training within a week of your first anticipated use.
1. General photolithography training
For the online part of general photolithography training, use Workday Learning:
RSRCH - CNF - General Photolithography Overview Video Training
Additionally, find required and recommended reading here:
For in-person general photolithography training, contact:
2. Tool training
For in-person training, contact the tool manager(s).
- No substrates smaller than 5 mm x 5 mm, unless approved by staff.
- No substrates with: dirty or contaminated back side, unbaked resist, loose parts, particulating coatings, etc.
The Heidelberg Instruments MLA 150 is a direct-write lithography system. Our unit is equipped with write mode I for feature sizes down to 0.6 μm and feature separation down to 0.8 μm, 405 nm and 375 nm exposure wavelengths, front and backside alignment, field by field wafer mapping alignment, 256-step grayscale, and many other capabilities. It accommodates substrates from 5 mm to 225 mm, with thicknesses up to 12 mm. The maximum writing speed is 285 mm²/min for both wavelengths.
Alignment accuracy is 250 nm for local alignment, 500 nm for global alignment, and 1000 nm for backside alignment. Alignment markers should be crosses with arms 2 μm to 8 μm wide and at least 200 μm long overall, for ease of finding the markers.